射频指纹的天线封装保证

Rouhan Noor, Liton Kumar Biswas, M. Shafkat, M. Khan, Yong-Kyu Yoon, Navid Asadizanjani
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引用次数: 0

摘要

封装天线(AiP)通过使用系统级封装(SiP)技术将天线阵列集成到小尺寸中,从而实现下一代高性能无线5G毫米波通信及其他通信。异构集成和先进封装的趋势可能会给半导体供应链带来更多的复杂性。此外,还存在更容易受到与高级打包相关的安全漏洞影响的风险。本文概述了先进封装和异构集成中的供应链漏洞,然后介绍了AiP现有的安全性、可靠性问题和保证。除了讨论AiP保障的现有物理模式和漏洞外,我们提出射频指纹(RFF)作为AiP保障的新物理模式。讨论了RFF在AiP保障中的研究方向和应用前景。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Antenna-in-Package Assurance with Radio Frequency Fingerprint
Abstract Antenna-in-packaging (AiP) enables the next generation of high-performance wireless 5G mmWave communication and beyond by incorporating antenna arrays in small form factors using System in Package (SiP) technology. The trend toward heterogeneous integration and advanced packaging will likely introduce more complexity to the semiconductor supply chain. In addition, there is also the risk of becoming more susceptible to security vulnerabilities associated with advanced packaging. This paper provides an overview of the supply chain vulnerabilities in advanced packaging and heterogeneous integration, followed by the existing security, reliability issues, and assurance of AiP. Apart from discussing existing physical modalities of AiP assurance and vulnerabilities, we propose Radio Frequency Fingerprint (RFF) as a new physical modality for AiP assurance. We also discuss possible future research direction and application of RFF in AiP assurance.
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