利用锁定热成像增强红外成像缺陷定位的方法

Anjanashree M.R. Sharma, Kristof J.P. Jacobs, Ingrid De Wolf
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引用次数: 0

摘要

在本文中,我们展示了三种方法来增强从锁定热成像(LIT)获得的红外图像的地形对比度。红外成像技术是半导体工业中广泛应用的失效分析(FA)技术之一。然而,由于器件的发射率对比度较差以及红外相机性能的限制,传统的LIT在室温下获得低对比度的地形图像。当使用印刷电路板加热器将待测器件从室温加热到75°C时,灰度地形对比度提高了85%。此外,提出了一种热辅助LIT方法,并在电漏电硅中间层样品上进行了演示。与在室温下进行的经典LIT相比,所获得的热点的地形对比度和信号强度都得到了增强。此外,开发了双LIT方法来减少热辅助方法的热收支。热点幅值和改进后的地形图像由连续两次锁定测量得到。此外,该技术的地形图像是通过在10分钟的时间内平均数百帧从相机获得的,这导致图像不太容易受到输入噪声水平的影响。为了提高FA过程的吞吐量,正交锁定热成像,一种双重用途的测量技术。通过三角调节,从同一锁定热像图中获得高对比度的地形图像和热点位置。这种方法的吞吐量与经典的LIT技术相同。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Methods to Enhance Infrared Imaging for Defect Localization Using Lock-in Thermography
Abstract In this paper, we demonstrate three approaches to enhance the topographical contrast of infrared images obtained from lockin thermography (LIT). Infrared imaging, particularly LIT, is one of the extensively used techniques for failure analysis (FA) in the semiconductor industry. However, low-contrast topography images are obtained at room temperature from conventional LIT due to poor emissivity contrast in the devices and the limitation on the performance of the infrared camera. The gray-scale topographical contrast is improved by 85% when the device under test is heated from room temperature to 75°C, using a printed circuit board heater. Furthermore, a heat-assisted LIT approach is proposed and demonstrated at the die level on an electrically leaky silicon interposer sample. The topographical contrast and the signal intensity of the hotspot obtained are enhanced when compared to the classical LIT, which is performed at room temperature. Further, the dual LIT approach is developed to reduce the thermal budget of the heat-assisted approach. The hotspot amplitude and improved topography image are obtained from two consecutive lock-in measurements. In addition, the topography image from this technique is obtained by averaging several hundred frames from the camera for a period of ten minutes, which results in an image that is less susceptible to input noise levels. To increase the throughput of the FA process, quadrature lock-in thermography, a dual-purpose measurement technique is shown. A high-contrast topography image and the hotspot location are obtained from the same lock-in thermogram by performing trigonometric conditioning. The throughput from this approach is the same as the classical LIT technique.
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