电路探测FAB洁净室环境中的硫化物污染管理

Kuan-Jui Tu, Frank Su, Wen-Fei Hsieh, Vincent Chen, Henry Lin, Y.S. Lou
{"title":"电路探测FAB洁净室环境中的硫化物污染管理","authors":"Kuan-Jui Tu, Frank Su, Wen-Fei Hsieh, Vincent Chen, Henry Lin, Y.S. Lou","doi":"10.31399/asm.cp.istfa2023p0209","DOIUrl":null,"url":null,"abstract":"Abstract Sulfur corrodes silver metal in a continuous reaction. This corrosion is also found in semiconductor industry processes for the application of silver into Backside Grinding & Backside Metal (BGBM). In this paper two experiments were conducted for the sulfide corrosion behavior in a Circuit Probing (CP) clean room environment. They were Mixed Flowing Gas (MFG) and clean room environment exposure test. The MFG test of this research was conducted in a testing chamber with temperature, relative humidity, and concentration of H2S were carefully controlled and monitored. The MFG test conditions included the test temperature of 25°C, relative humidity of 75 %, and H2S gas concentration of 10 ppb. And the MFG tests lasted for over 72 hours. The X-ray photoelectron spectroscopy (XPS) was used to analyze the elements composition and Ag2S film thickness of the MFG test samples. The second test of this research was the direct exposure experiment. The silicon samples deposited with appropriate silver layer thickness were exposed in CP fab clean room environment with H2S concentration well monitored. The XPS analysis results of the corresponding exposure test samples indicated that the Ag2S contamination would continue to develop and wouldn't saturate. This would be indicative for the management of Ag2S contamination control. The results of MFG and Exposure test were help for Ardentec to setup Ag2S corrosion methodology. All the managements were applied into daily operation of the BGBM semiconductor products.","PeriodicalId":20443,"journal":{"name":"Proceedings","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2023-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"The Sulfide Contamination Management in Circuit Probing FAB Clean Room Environment\",\"authors\":\"Kuan-Jui Tu, Frank Su, Wen-Fei Hsieh, Vincent Chen, Henry Lin, Y.S. Lou\",\"doi\":\"10.31399/asm.cp.istfa2023p0209\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Abstract Sulfur corrodes silver metal in a continuous reaction. This corrosion is also found in semiconductor industry processes for the application of silver into Backside Grinding & Backside Metal (BGBM). In this paper two experiments were conducted for the sulfide corrosion behavior in a Circuit Probing (CP) clean room environment. They were Mixed Flowing Gas (MFG) and clean room environment exposure test. The MFG test of this research was conducted in a testing chamber with temperature, relative humidity, and concentration of H2S were carefully controlled and monitored. The MFG test conditions included the test temperature of 25°C, relative humidity of 75 %, and H2S gas concentration of 10 ppb. And the MFG tests lasted for over 72 hours. The X-ray photoelectron spectroscopy (XPS) was used to analyze the elements composition and Ag2S film thickness of the MFG test samples. The second test of this research was the direct exposure experiment. The silicon samples deposited with appropriate silver layer thickness were exposed in CP fab clean room environment with H2S concentration well monitored. The XPS analysis results of the corresponding exposure test samples indicated that the Ag2S contamination would continue to develop and wouldn't saturate. This would be indicative for the management of Ag2S contamination control. The results of MFG and Exposure test were help for Ardentec to setup Ag2S corrosion methodology. All the managements were applied into daily operation of the BGBM semiconductor products.\",\"PeriodicalId\":20443,\"journal\":{\"name\":\"Proceedings\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-11-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.31399/asm.cp.istfa2023p0209\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.31399/asm.cp.istfa2023p0209","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

硫在连续反应中腐蚀银金属。这种腐蚀也存在于半导体工业过程中,用于将银应用于背面研磨和;背面金属(BGBM)。本文对电路探测(CP)洁净室环境下的硫化物腐蚀行为进行了实验研究。分别是混合流动气体(MFG)和洁净室环境暴露试验。本研究的MFG试验在实验室内进行,对温度、相对湿度和H2S浓度进行了严格的控制和监测。MFG试验条件为试验温度25℃,相对湿度75%,H2S气体浓度10 ppb。MFG测试持续了超过72小时。利用x射线光电子能谱(XPS)分析了MFG测试样品的元素组成和Ag2S膜厚度。这项研究的第二个测试是直接暴露实验。将沉积有适当银层厚度的硅样品暴露在CP晶圆厂洁净室环境中,并对H2S浓度进行监测。相应暴露试验样品的XPS分析结果表明,Ag2S污染将继续发展,不会饱和。这对Ag2S污染控制的管理具有指导意义。MFG和暴露试验的结果有助于Ardentec建立Ag2S腐蚀方法。所有的管理都应用到BGBM半导体产品的日常运营中。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The Sulfide Contamination Management in Circuit Probing FAB Clean Room Environment
Abstract Sulfur corrodes silver metal in a continuous reaction. This corrosion is also found in semiconductor industry processes for the application of silver into Backside Grinding & Backside Metal (BGBM). In this paper two experiments were conducted for the sulfide corrosion behavior in a Circuit Probing (CP) clean room environment. They were Mixed Flowing Gas (MFG) and clean room environment exposure test. The MFG test of this research was conducted in a testing chamber with temperature, relative humidity, and concentration of H2S were carefully controlled and monitored. The MFG test conditions included the test temperature of 25°C, relative humidity of 75 %, and H2S gas concentration of 10 ppb. And the MFG tests lasted for over 72 hours. The X-ray photoelectron spectroscopy (XPS) was used to analyze the elements composition and Ag2S film thickness of the MFG test samples. The second test of this research was the direct exposure experiment. The silicon samples deposited with appropriate silver layer thickness were exposed in CP fab clean room environment with H2S concentration well monitored. The XPS analysis results of the corresponding exposure test samples indicated that the Ag2S contamination would continue to develop and wouldn't saturate. This would be indicative for the management of Ag2S contamination control. The results of MFG and Exposure test were help for Ardentec to setup Ag2S corrosion methodology. All the managements were applied into daily operation of the BGBM semiconductor products.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
1
审稿时长
11 weeks
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信