微波复合加热对Sn3.0Ag0.5Cu/Cu焊点力学性能和组织的影响

IF 1 Q4 ENGINEERING, MECHANICAL

International Journal of Automotive and Mechanical Engineering Pub Date : 2023-10-17 DOI:10.15282/ijame.20.3.2023.15.0829

SRA. Idris, MN Mazelan

{"title":"微波复合加热对Sn3.0Ag0.5Cu/Cu焊点力学性能和组织的影响","authors":"SRA. Idris, MN Mazelan","doi":"10.15282/ijame.20.3.2023.15.0829","DOIUrl":null,"url":null,"abstract":"Microwave hybrid heating (MHH) has become soldering’s alternative method for lead-free solder alloys due to its benefits towards modern microtechnology, such as shorter processing time, lower energy consumption and lower defect rate. Nonetheless, it still requires susceptors to improve its heating performance, such as SiC, which is known for its high loss factor under low microwave frequencies. In this study, the effect of microwave hybrid heating on mechanical properties, as well as the microstructure of solder joint between Sn3.0Ag0.5Cu (SAC305) solder alloy and Cu substrate was investigated. Solder joint was created using MHH with different soldering parameters (amount of SiC in a range of 3-7g and exposure time in a range of 7-10min) between SAC305 solder alloy (in the form of wire and paste) and Cu substrate. Then, a lap shear test was carried out following a standard of ASTM D1002 to determine solder joint strength. Characterization was made using an optical microscope and scanning electron microscopy. Results showed that solder wire produced the highest solder joint strength with the value of 115.45 MPa when using 3.05g of SiC for 8.92min soldering time. Meanwhile, the solder paste produced 109.76MPa solder joint strength when using 3.03 g of SiC for 9.39 min soldering time. The intermetallic compound (IMC) form was scallop-like Cu6Sn5, both solder/substrate joints with a thickness of 2.87 μm for solder wire and 3.62 μm for solder paste. Nonetheless, an excessive amount of SiC would generate more heat in MHH and increase the IMC thickness as well as reduce shear strength, which eventually decreases the solder joint stability.","PeriodicalId":13935,"journal":{"name":"International Journal of Automotive and Mechanical Engineering","volume":"67 1","pages":"0"},"PeriodicalIF":1.0000,"publicationDate":"2023-10-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Effect of Microwave Hybrid Heating on Mechanical Properties and Microstructure of Sn3.0Ag0.5Cu/Cu Solder Joints\",\"authors\":\"SRA. Idris, MN Mazelan\",\"doi\":\"10.15282/ijame.20.3.2023.15.0829\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Microwave hybrid heating (MHH) has become soldering’s alternative method for lead-free solder alloys due to its benefits towards modern microtechnology, such as shorter processing time, lower energy consumption and lower defect rate. Nonetheless, it still requires susceptors to improve its heating performance, such as SiC, which is known for its high loss factor under low microwave frequencies. In this study, the effect of microwave hybrid heating on mechanical properties, as well as the microstructure of solder joint between Sn3.0Ag0.5Cu (SAC305) solder alloy and Cu substrate was investigated. Solder joint was created using MHH with different soldering parameters (amount of SiC in a range of 3-7g and exposure time in a range of 7-10min) between SAC305 solder alloy (in the form of wire and paste) and Cu substrate. Then, a lap shear test was carried out following a standard of ASTM D1002 to determine solder joint strength. Characterization was made using an optical microscope and scanning electron microscopy. Results showed that solder wire produced the highest solder joint strength with the value of 115.45 MPa when using 3.05g of SiC for 8.92min soldering time. Meanwhile, the solder paste produced 109.76MPa solder joint strength when using 3.03 g of SiC for 9.39 min soldering time. The intermetallic compound (IMC) form was scallop-like Cu6Sn5, both solder/substrate joints with a thickness of 2.87 μm for solder wire and 3.62 μm for solder paste. Nonetheless, an excessive amount of SiC would generate more heat in MHH and increase the IMC thickness as well as reduce shear strength, which eventually decreases the solder joint stability.\",\"PeriodicalId\":13935,\"journal\":{\"name\":\"International Journal of Automotive and Mechanical Engineering\",\"volume\":\"67 1\",\"pages\":\"0\"},\"PeriodicalIF\":1.0000,\"publicationDate\":\"2023-10-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Journal of Automotive and Mechanical Engineering\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.15282/ijame.20.3.2023.15.0829\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"ENGINEERING, MECHANICAL\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Automotive and Mechanical Engineering","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.15282/ijame.20.3.2023.15.0829","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"ENGINEERING, MECHANICAL","Score":null,"Total":0}

引用次数: 0

摘要

微波混合加热(MHH)由于其对现代微技术的优点，如加工时间短、能耗低和缺品率低，已成为无铅焊料合金焊接的替代方法。尽管如此，它仍然需要感受器来改善其加热性能，例如以低微波频率下的高损耗因子而闻名的SiC。在本研究中，研究了微波复合加热对Sn3.0Ag0.5Cu (SAC305)钎料合金与Cu衬底的力学性能和焊点组织的影响。在SAC305焊料合金(以线材和膏体的形式)和Cu衬底之间，采用不同焊接参数(SiC用量在3-7g范围内，暴露时间在7-10min范围内)的MHH制作焊点。然后，按照ASTM D1002的标准进行搭接剪切试验，以确定焊点强度。利用光学显微镜和扫描电镜对其进行了表征。结果表明:当SiC用量为3.05g，焊接时间为8.92min时，焊丝的焊点强度最高，为115.45 MPa;同时，当SiC用量为3.03 g，焊接时间为9.39 min时，锡膏的焊点强度为109.76MPa。金属间化合物(IMC)形态为扇贝状Cu6Sn5，焊锡线厚度为2.87 μm，焊膏厚度为3.62 μm。然而，过量的SiC会在MHH中产生更多的热量，增加IMC厚度，降低抗剪强度，最终降低焊点的稳定性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Effect of Microwave Hybrid Heating on Mechanical Properties and Microstructure of Sn3.0Ag0.5Cu/Cu Solder Joints

Microwave hybrid heating (MHH) has become soldering’s alternative method for lead-free solder alloys due to its benefits towards modern microtechnology, such as shorter processing time, lower energy consumption and lower defect rate. Nonetheless, it still requires susceptors to improve its heating performance, such as SiC, which is known for its high loss factor under low microwave frequencies. In this study, the effect of microwave hybrid heating on mechanical properties, as well as the microstructure of solder joint between Sn3.0Ag0.5Cu (SAC305) solder alloy and Cu substrate was investigated. Solder joint was created using MHH with different soldering parameters (amount of SiC in a range of 3-7g and exposure time in a range of 7-10min) between SAC305 solder alloy (in the form of wire and paste) and Cu substrate. Then, a lap shear test was carried out following a standard of ASTM D1002 to determine solder joint strength. Characterization was made using an optical microscope and scanning electron microscopy. Results showed that solder wire produced the highest solder joint strength with the value of 115.45 MPa when using 3.05g of SiC for 8.92min soldering time. Meanwhile, the solder paste produced 109.76MPa solder joint strength when using 3.03 g of SiC for 9.39 min soldering time. The intermetallic compound (IMC) form was scallop-like Cu6Sn5, both solder/substrate joints with a thickness of 2.87 μm for solder wire and 3.62 μm for solder paste. Nonetheless, an excessive amount of SiC would generate more heat in MHH and increase the IMC thickness as well as reduce shear strength, which eventually decreases the solder joint stability.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

International Journal of Automotive and Mechanical Engineering ENGINEERING, MECHANICAL-

CiteScore

2.40

自引率

10.00%

发文量

审稿时长

20 weeks

期刊介绍： The IJAME provides the forum for high-quality research communications and addresses all aspects of original experimental information based on theory and their applications. This journal welcomes all contributions from those who wish to report on new developments in automotive and mechanical engineering fields within the following scopes. -Engine/Emission Technology Automobile Body and Safety- Vehicle Dynamics- Automotive Electronics- Alternative Energy- Energy Conversion- Fuels and Lubricants - Combustion and Reacting Flows- New and Renewable Energy Technologies- Automotive Electrical Systems- Automotive Materials- Automotive Transmission- Automotive Pollution and Control- Vehicle Maintenance- Intelligent Vehicle/Transportation Systems- Fuel Cell, Hybrid, Electrical Vehicle and Other Fields of Automotive Engineering- Engineering Management /TQM- Heat and Mass Transfer- Fluid and Thermal Engineering- CAE/FEA/CAD/CFD- Engineering Mechanics- Modeling and Simulation- Metallurgy/ Materials Engineering- Applied Mechanics- Thermodynamics- Agricultural Machinery and Equipment- Mechatronics- Automatic Control- Multidisciplinary design and optimization - Fluid Mechanics and Dynamics- Thermal-Fluids Machinery- Experimental and Computational Mechanics - Measurement and Instrumentation- HVAC- Manufacturing Systems- Materials Processing- Noise and Vibration- Composite and Polymer Materials- Biomechanical Engineering- Fatigue and Fracture Mechanics- Machine Components design- Gas Turbine- Power Plant Engineering- Artificial Intelligent/Neural Network- Robotic Systems- Solar Energy- Powder Metallurgy and Metal Ceramics- Discrete Systems- Non-linear Analysis- Structural Analysis- Tribology- Engineering Materials- Mechanical Systems and Technology- Pneumatic and Hydraulic Systems - Failure Analysis- Any other related topics.