{"title":"界面或整体残余应力驱动下两个结合弹性体的界面不稳定性","authors":"C. Q. Ru","doi":"10.1007/s10338-023-00432-w","DOIUrl":null,"url":null,"abstract":"<div><p>Inspired by recent research interest in the interface wrinkling of bonded materials in diverse areas of 3D printing, the present work studies the interfacial instability of two bonded elastic bodies driven by negative interfacial tension or compressible bulk residual stress. For interfacial instability modes decaying exponentially with distance from the interface, the present model is formulated for two bonded elastic half-spaces with a planar interface under plane strain. An explicit expression is given for the wavenumber of interfacial instability driven by negative interfacial tension, and a critical condition is derived for interfacial instability driven by compressive bulk residual stress. The derived results are validated with comparison to known results on surface instability of an elastic half-space, and the role of shear modulus ratio and Poisson’s ratios of two bonded elastic bodies in interfacial instability, an issue to be addressed in literature, is studied with specific reference to material parameters used in some areas of 3D printing.</p></div>","PeriodicalId":50892,"journal":{"name":"Acta Mechanica Solida Sinica","volume":"36 6","pages":"914 - 920"},"PeriodicalIF":2.0000,"publicationDate":"2023-10-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Interfacial Instability of Two Bonded Elastic Bodies Driven by Interface or Bulk Residual Stress\",\"authors\":\"C. Q. Ru\",\"doi\":\"10.1007/s10338-023-00432-w\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>Inspired by recent research interest in the interface wrinkling of bonded materials in diverse areas of 3D printing, the present work studies the interfacial instability of two bonded elastic bodies driven by negative interfacial tension or compressible bulk residual stress. For interfacial instability modes decaying exponentially with distance from the interface, the present model is formulated for two bonded elastic half-spaces with a planar interface under plane strain. An explicit expression is given for the wavenumber of interfacial instability driven by negative interfacial tension, and a critical condition is derived for interfacial instability driven by compressive bulk residual stress. The derived results are validated with comparison to known results on surface instability of an elastic half-space, and the role of shear modulus ratio and Poisson’s ratios of two bonded elastic bodies in interfacial instability, an issue to be addressed in literature, is studied with specific reference to material parameters used in some areas of 3D printing.</p></div>\",\"PeriodicalId\":50892,\"journal\":{\"name\":\"Acta Mechanica Solida Sinica\",\"volume\":\"36 6\",\"pages\":\"914 - 920\"},\"PeriodicalIF\":2.0000,\"publicationDate\":\"2023-10-30\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Acta Mechanica Solida Sinica\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://link.springer.com/article/10.1007/s10338-023-00432-w\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Acta Mechanica Solida Sinica","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s10338-023-00432-w","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
Interfacial Instability of Two Bonded Elastic Bodies Driven by Interface or Bulk Residual Stress
Inspired by recent research interest in the interface wrinkling of bonded materials in diverse areas of 3D printing, the present work studies the interfacial instability of two bonded elastic bodies driven by negative interfacial tension or compressible bulk residual stress. For interfacial instability modes decaying exponentially with distance from the interface, the present model is formulated for two bonded elastic half-spaces with a planar interface under plane strain. An explicit expression is given for the wavenumber of interfacial instability driven by negative interfacial tension, and a critical condition is derived for interfacial instability driven by compressive bulk residual stress. The derived results are validated with comparison to known results on surface instability of an elastic half-space, and the role of shear modulus ratio and Poisson’s ratios of two bonded elastic bodies in interfacial instability, an issue to be addressed in literature, is studied with specific reference to material parameters used in some areas of 3D printing.
期刊介绍:
Acta Mechanica Solida Sinica aims to become the best journal of solid mechanics in China and a worldwide well-known one in the field of mechanics, by providing original, perspective and even breakthrough theories and methods for the research on solid mechanics.
The Journal is devoted to the publication of research papers in English in all fields of solid-state mechanics and its related disciplines in science, technology and engineering, with a balanced coverage on analytical, experimental, numerical and applied investigations. Articles, Short Communications, Discussions on previously published papers, and invitation-based Reviews are published bimonthly. The maximum length of an article is 30 pages, including equations, figures and tables