固体中封装等离子体的光子应用

IF 6.3 3区综合性期刊 Q1 Multidisciplinary

Fundamental Research Pub Date : 2025-09-01 DOI:10.1016/j.fmre.2023.10.002

Rang Li , Chi Pang , Xiaoli Sun , Kambiz Jamshidi , Shengqiang Zhou , Feng Chen

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引用次数: 0

摘要

等离子体为下一代光子应用提供了一个有前途的框架，包括光镊、超快激光和量子通信。将等离子体集成到光子学中可以在异构系统之间实现有效的接口耦合，从而提高性能和多样化的功能。本文综述了用于开发等离子体嵌入纳米复合材料的各种独特封装方法。系统总结了封装等离子体操纵机制的最新研究进展，为优化光学性能提供了主动调制平台。考虑到机遇和挑战，可调谐封装等离子体的进步显示出良好的前景，正如讨论最近在光子应用方面的重大进展的部分所证明的那样。

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Manipulation of encapsulated plasmons in solids for photonic applications

Plasmonics offers a promising framework for next-generation photonic applications, including optical tweezers, ultrafast lasing, and quantum communication. Integrating plasmonics into photonics enables efficient interface coupling between heterogeneous systems, resulting in enhanced performance and diverse functionality. This review presents various unique encapsulation methods for developing plasmonics-embedded hybrid nanocomposite systems. Recent progress in the manipulation mechanisms of encapsulated plasmons is systematically summarized, offering an active modulation platform for optimizing optical performance. Considering the opportunities and challenges, the advancement of tunable encapsulated plasmons exhibits promising prospects, as demonstrated by a section discussing recent significant progress in photonic applications.

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