改变带螺纹蒸发器的重力热管形状对其传热特性的影响

L. V. Lipnitskyi, R. S. Melnyk, Yu. E. Nikolaenko, V. Yu. Kravets, D. V. Pekur
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引用次数: 0

摘要

电子学的现代发展与减小设备的质量和尺寸同时增加其功率的问题有关。这会导致单个元件和整个设备的温度升高,从而降低设备的可靠性。这使得开发廉价而高效的冷却系统成为一项紧迫的任务。解决这一问题的方法之一是在冷却系统中使用一种新的简化设计的热管。本文比较了带螺纹蒸发器的圆柱形铜重力热管在压平前后的热特性。实验所用工质为R141b。在冷凝区强制对流冷却条件下,在相对于水平的两个倾斜角度进行了实验研究。在5 ~ 70 W的热功率范围内,给出了体形由圆柱形变为扁平对热管受热区温度、热阻、蒸发和冷凝区换热系数的影响。热管的选择是根据电子元件的最大热负荷和冷却系统在空间中的方向来确定的。将热管的形状从圆柱形改为扁平会导致最大热功率传输的减少,但扁平的热管形状在技术上更适合用于电子设备的冷却系统。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Impact of changing the shape of gravity heat pipe with threaded evaporator on its heat transfer characteristics
The modern development of electronics is associated with the problem of reducing the mass and size of the equipment while increasing its power. This leads to an increase in the temperature of both individual elements and the device as a whole, which contributes to a decrease in equipment reliability. This makes the development of inexpensive yet efficient cooling systems an urgent task. One of the ways to solve this problem is to use heat pipes of a new simplified design in cooling systems. This article compares the thermal characteristics of a cylindrical copper gravity heat pipe with a threaded evaporator before and after flattening. The working fluid used in the experiment was R141b. Experimental studies were conducted at two tilt angles relative to the horizontal under the conditions of forced convection cooling of the condensation zone. The influence of the change in the shape of the body from cylindrical to flat on the temperature in the heating zone of the heat pipe, thermal resistance, and heat transfer coefficients in the evaporation and condensation zones was shown in the range of heat power from 5 to 70 W. The choice of the heat pipe is justified based on the maximum thermal loads of electronic components and the orientation of the cooling system in space. Changing the shape of heat pipe from cylindrical to flat leads to a decrease in the maximum thermal power transmitted, but a flat heat pipe shape is more technologically feasible for use in cooling systems of electronic equipment.
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