{"title":"铜夹层对线弧定向能沉积中不锈钢-铝过渡结构界面特性的影响","authors":"Amrit Raj Paul, Manidipto Mukherjee, Mohit Kumar Sahu","doi":"10.1108/rpj-03-2023-0089","DOIUrl":null,"url":null,"abstract":"Purpose The purpose of this study is to investigate the deposition of SS–Al transitional wall using the wire arc directed energy deposition (WA-DED) process with a Cu interlayer. This study also aims to analyse the metallographic properties of the SS–Cu and Al–Cu interfaces and their mechanical properties. Design/methodology/approach The study used transitional deposition of SS–Al material over each other by incorporating Cu as interlayer between the two. The scanning electron microscope analysis, energy dispersive X-ray analysis, X-ray diffractometer analysis, tensile testing and micro-hardness measurement were performed to investigate the interface characteristics and mechanical properties of the SS–Al transitional wall. Findings The study discovered that the WA-DED process with a Cu interlayer worked well for the deposition of SS–Al transitional walls. The formation of solid solutions of Fe–Cu and Fe–Si was observed at the SS–Cu interface rather than intermetallic compounds (IMCs), according to the metallographic analysis. On the other hand, three different IMCs were formed at the Al–Cu interface, namely, Al–Cu, Al 2 Cu and Al 4 Cu 9 . The study also observed the formation of a lamellar structure of Al and Al 2 Cu at the hypereutectic phase. The mechanical testing revealed that the Al–Cu interface failed without significant deformation, i.e. < 4.73%, indicating the brittleness of the interface. Originality/value The study identified the formation of HCP–Fe at the SS–Cu interface, which has not been previously reported in additive manufacturing literature. Furthermore, the study observed the formation of a lamellar structure of Al and Al2Cu phase at the hypereutectic phase, which has not been previously reported in SS–Al transitional wall deposition.","PeriodicalId":20981,"journal":{"name":"Rapid Prototyping Journal","volume":null,"pages":null},"PeriodicalIF":3.4000,"publicationDate":"2023-09-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Influence of copper interlayer on the interface characteristics of stainless steel–aluminium transitional structure in wire arc directed energy deposition\",\"authors\":\"Amrit Raj Paul, Manidipto Mukherjee, Mohit Kumar Sahu\",\"doi\":\"10.1108/rpj-03-2023-0089\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Purpose The purpose of this study is to investigate the deposition of SS–Al transitional wall using the wire arc directed energy deposition (WA-DED) process with a Cu interlayer. This study also aims to analyse the metallographic properties of the SS–Cu and Al–Cu interfaces and their mechanical properties. Design/methodology/approach The study used transitional deposition of SS–Al material over each other by incorporating Cu as interlayer between the two. The scanning electron microscope analysis, energy dispersive X-ray analysis, X-ray diffractometer analysis, tensile testing and micro-hardness measurement were performed to investigate the interface characteristics and mechanical properties of the SS–Al transitional wall. Findings The study discovered that the WA-DED process with a Cu interlayer worked well for the deposition of SS–Al transitional walls. The formation of solid solutions of Fe–Cu and Fe–Si was observed at the SS–Cu interface rather than intermetallic compounds (IMCs), according to the metallographic analysis. On the other hand, three different IMCs were formed at the Al–Cu interface, namely, Al–Cu, Al 2 Cu and Al 4 Cu 9 . The study also observed the formation of a lamellar structure of Al and Al 2 Cu at the hypereutectic phase. The mechanical testing revealed that the Al–Cu interface failed without significant deformation, i.e. < 4.73%, indicating the brittleness of the interface. Originality/value The study identified the formation of HCP–Fe at the SS–Cu interface, which has not been previously reported in additive manufacturing literature. Furthermore, the study observed the formation of a lamellar structure of Al and Al2Cu phase at the hypereutectic phase, which has not been previously reported in SS–Al transitional wall deposition.\",\"PeriodicalId\":20981,\"journal\":{\"name\":\"Rapid Prototyping Journal\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":3.4000,\"publicationDate\":\"2023-09-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Rapid Prototyping Journal\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1108/rpj-03-2023-0089\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"ENGINEERING, MECHANICAL\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Rapid Prototyping Journal","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1108/rpj-03-2023-0089","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, MECHANICAL","Score":null,"Total":0}
Influence of copper interlayer on the interface characteristics of stainless steel–aluminium transitional structure in wire arc directed energy deposition
Purpose The purpose of this study is to investigate the deposition of SS–Al transitional wall using the wire arc directed energy deposition (WA-DED) process with a Cu interlayer. This study also aims to analyse the metallographic properties of the SS–Cu and Al–Cu interfaces and their mechanical properties. Design/methodology/approach The study used transitional deposition of SS–Al material over each other by incorporating Cu as interlayer between the two. The scanning electron microscope analysis, energy dispersive X-ray analysis, X-ray diffractometer analysis, tensile testing and micro-hardness measurement were performed to investigate the interface characteristics and mechanical properties of the SS–Al transitional wall. Findings The study discovered that the WA-DED process with a Cu interlayer worked well for the deposition of SS–Al transitional walls. The formation of solid solutions of Fe–Cu and Fe–Si was observed at the SS–Cu interface rather than intermetallic compounds (IMCs), according to the metallographic analysis. On the other hand, three different IMCs were formed at the Al–Cu interface, namely, Al–Cu, Al 2 Cu and Al 4 Cu 9 . The study also observed the formation of a lamellar structure of Al and Al 2 Cu at the hypereutectic phase. The mechanical testing revealed that the Al–Cu interface failed without significant deformation, i.e. < 4.73%, indicating the brittleness of the interface. Originality/value The study identified the formation of HCP–Fe at the SS–Cu interface, which has not been previously reported in additive manufacturing literature. Furthermore, the study observed the formation of a lamellar structure of Al and Al2Cu phase at the hypereutectic phase, which has not been previously reported in SS–Al transitional wall deposition.
期刊介绍:
Rapid Prototyping Journal concentrates on development in a manufacturing environment but covers applications in other areas, such as medicine and construction. All papers published in this field are scattered over a wide range of international publications, none of which actually specializes in this particular discipline, this journal is a vital resource for anyone involved in additive manufacturing. It draws together important refereed papers on all aspects of AM from distinguished sources all over the world, to give a truly international perspective on this dynamic and exciting area.
-Benchmarking – certification and qualification in AM-
Mass customisation in AM-
Design for AM-
Materials aspects-
Reviews of processes/applications-
CAD and other software aspects-
Enhancement of existing processes-
Integration with design process-
Management implications-
New AM processes-
Novel applications of AM parts-
AM for tooling-
Medical applications-
Reverse engineering in relation to AM-
Additive & Subtractive hybrid manufacturing-
Industrialisation