以玻璃纤维为载体的导电膜胶粘剂的机械性能和导电性能评价

Q4 Engineering
Weiyu Zhang, Yuan Zhao, Zhongwei Liu, Stone Cheng
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引用次数: 0

摘要

导电组装膜粘合剂广泛应用于医疗、电信、航空航天和国防系统。在电子设备组装过程中,玻璃布经常被用作薄膜粘合剂的载体,以提高其可加工性。此外,实际应用表明,以玻璃织物为载体的薄膜胶粘剂可以粘合热膨胀系数严重不匹配的粘合剂。然而,嵌入玻璃织物对组装膜整体性能的影响还没有系统的研究。为了解决这一知识上的差距,进行了一项研究,比较导电膜粘合剂的性能与没有玻璃织物载体。研究的重点是薄膜粘合剂的机械性能,包括搭接剪切强度、拉伸模量以及处理热膨胀系数不匹配的应用的能力。此外,该研究还评估了载体对薄膜粘合剂的导电性和导热性的影响。总的来说,这一综合评估提供了对玻璃织物载体对薄膜粘合剂性能的有效性的见解。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
An Evaluation on the Mechanical and Conductive Performance of Electrically Conductive Film Adhesives with Glass Fabric Carriers
Conductive assembly film adhesives are extensively employed in medical, telecom, aerospace, and defense systems. Glass fabric cloth is frequently utilized as the carrier in many film adhesives to enhance handling and processability during electronic device assembly. Furthermore, practical applications have shown that film adhesives with glass fabric carriers can bond adherends with severely mismatched coefficients of thermal expansion. However, the impact of embedding glass fabric on the overall performance of assembly films has not been systematically investigated. To address this gap in knowledge, a study was conducted to compare the performance of electrically conductive film adhesives with and without the glass fabric carriers. The study focused on the mechanical performance of the film adhesives, including lap shear strength, tensile modulus, and the ability to manage applications with mismatched coefficients of thermal expansion. Additionally, the study assessed the impact of the carrier on the electrical and thermal conductivity of the film adhesives. Overall, this integrated assessment provides insights into the effectiveness of the glass fabric carrier on the performance of film adhesives.
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来源期刊
Journal of Microelectronics and Electronic Packaging
Journal of Microelectronics and Electronic Packaging Engineering-Electrical and Electronic Engineering
CiteScore
1.30
自引率
0.00%
发文量
5
期刊介绍: The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.
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