粉末法在氧化锆基体中加入铜时的热导率、机械性能值的计算

Fatima W. Ridha
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引用次数: 0

摘要

粉末冶金在制造工具、电刷、过滤器等方面有着广泛的工业应用。以氧化锆为基体,以恒定速率3%的硅为支撑材料,铜的增强率分别为(3、6、9、12、15)%。用液压机在5吨压力下进行压制过程。采用直径为10mm的压模。将压制得到的试样在1000℃下烧结1小时,计算烧结后的热、力学和结构性能,包括导热系数、热扩散、热流、热容量、热阻、维氏硬度、抗压强度、磨损和扫描电镜。在理想的热烧结条件下,烧结温度为1000℃,混合比为15%Cu,获得了令人鼓舞的结果,导热系数为66.34W/m。K,热扩散系数为2.2416 mm2/秒,热流密度为420.424 w / 2/ m2。K,热容量为440.2512J/kg。K,热阻为0.00103 m2.K/W。维氏硬度为602Kg/mm2,抗压强度为71MPa,磨损量为3×10-8g/cm。对于合成结果,包括扫描电镜,结果表明,当添加率为15%时,均匀性和网状一致性最好,并且还注意到氧化锆在铜表面的扩散是明显的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Calculation of Thermal Conductivity, Mechanical Properties Values at Adding Copper to a Base of Zirconia by Powder Method
Powder metallurgy has a wide range of industrial applications in the manufacture of tools, brushes, filters, and others. As a base of zirconia metal was used and supported by silicon at a constant rate of 3% Si with different reinforcement percentages of copper, which are (3,6,9,12,15)%. The pressing process was carried out at a pressure of 5 tons with a hydraulic press. A pressing mold with a diameter of 10 mm was used. The samples resulting from the press were sintered at 1000°C for one hour, and the thermal, mechanical, and structural properties were calculated after sintering, which included thermal conductivity, thermal diffusion, heat flow, heat capacity, thermal resistance, Vickers hardness, compressive strength, wear, and scanning electron microscopy. Under ideal conditions of thermal sintering at 1000°C, and a mixing ratio of 15%Cu, encouraging results were obtained, with a thermal conductivity of 66.34W/m.K, a thermal diffusivity of 2.2416 mm2/sec, a heat flux of 420.424 Ws½/m2.K, and a heat capacity of 440.2512J/kg.K, with a thermal resistance of 0.00103 m2.K/W. While the Vickers hardness was 602Kg/mm2, the compressive strength was 71MPa, and the wear and tear was 3×10-8g/cm. As for the synthetic results, which included the scanning electron microscope, it showed that the best homogeneity and reticular consistency was at the addition rate of 15%, and it was also noted that the spread of zirconia on the surface of copper was significant.
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