SiC CMOS电子元件在500°C下的延长寿命测试

Emad Andarawis, Cheng-Po (Paul) Chen, Jeremy Popp, Liang Yin, David Shaddock
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引用次数: 0

摘要

碳化硅(SiC) CMOS电子器件是实现高水平集成的一种很有前途的方法,特别是在实现数字功能方面,同时与纯nmos或JFET方法相比,可显着降低芯片上的功耗。基于mosfet的电子器件中的栅极氧化物在极端温度下工作对可靠性构成潜在挑战。GE之前开发了栅极氧化物可靠性模型,预测在500°C下可靠运行,但之前没有进行实验验证。介绍了SiC CMOS集成电路500℃连续工作60天的最新测试结果。结果表明,在500℃的温度下,栅极氧化物能延长NMOS和PMOS器件的工作时间。从而实现在极端温度>=500°C下实现更复杂数字功能的路线图。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Extended Lifetime Testing of SiC CMOS Electronics at 500°C
Silicon Carbide (SiC) CMOS electronics is a promising approach for realizing high level of integration, especially for implementing digital functions, while significantly reducing the power dissipation on chip compared to NMOS-only, or JFET approaches. Gate oxide in MOSFET-based electronics pose a potential reliability challenge for operating at extreme temperatures. GE has previously developed gate oxide reliability models that predicted reliable operation at 500°C, but experimental validation had not been conducted previously. Recent testing results of testing of 500°C operation of SiC CMOS based integrated circuit over 60 days of continuous operation are presented. The results show the gate oxide surviving extended operating time of both NMOS and PMOS devices at 500°C. and thereby enabling a roadmap towards realizing more complex digital function at extreme temperature >=500°C.
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