碳化硅降压变换器的分析与建模及其在电动汽车上的应用

IF 2.2 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Utsav Gupta, Andras Vass-Varnai, Voon H Wong, Ayman Fayed
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引用次数: 0

摘要

电力电子元件存在于电动汽车的各个领域,从动力系统到电机,从电池到辅助负载,这些转换器都是用硅(Si)制造的。然而,还有许多其他应用,其中对功率转换器的设计要求过于严格,无法使用传统的硅基解决方案来满足。这包括在电动汽车、国防领域的应用。航空航天、地下勘探和地热能。对于此类应用中的功率转换器,SiC比Si具有许多优点。在进行电源变换器的电气设计时,热方面通常被忽略,导致仿真和实际应用存在巨大差异。本文旨在说明如何考虑热特性的功率转换器是有益的,以及它如何影响结果。这是用两种不同的SiC器件模型来完成的,以复制结果并证明分析的结论。首先,介绍了降压变换器的电气设计,然后详细说明了设计的热方面。最后,将这两个方面结合起来,并在多个不同的情况下进行了详细的模拟,这些模拟提供了验证假设的显着差异的结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Analysis And Modeling Of A Sic Based Buck Converter And Its Effects In An Electric Vehicle Application
Abstract Power electronic components are found in all areas of an electric vehicle, from power train to motors and from battery to ancillary loads and these converters are manufactured in Silicon (Si). However, there are many other applications where the design requirements on power converters are too stringent to be met using conventional Silicon-based solutions. This includes applications in electric vehicles, defense & aerospace, subterranean exploration, and geothermal energy. For power converters in such applications, SiC offers many advantages over Si. While doing the electrical design of a power converter, the thermal aspects are usually neglected causing a vast difference in the simulation and real-life application. This paper aims to show how taking thermal characteristics into account for a power converter is beneficial and how it influences the results. This is done with two different SiC device models to replicate the results and to demonstrate the conclusiveness of the analysis. First, the electrical design of a buck converter is presented and then the thermal aspects of a design are explained in detail. Finally, both aspects are combined, and detailed simulations are shown in multiple different cases which provide a significant difference in the results validating the hypothesis.
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来源期刊
Journal of Electronic Packaging
Journal of Electronic Packaging 工程技术-工程:电子与电气
CiteScore
4.90
自引率
6.20%
发文量
44
审稿时长
3 months
期刊介绍: The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.
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