外电路对电容耦合等离子体中CF4击穿过程的影响

Zhaoyu Chen, Jingwen Xu, Hongyu Wang, Hao Wu, Wei Jiang, Ya Zhang
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引用次数: 0

摘要

电容耦合等离子体(CCP)工具在半导体工业的蚀刻、沉积和清洁过程中至关重要。全面了解其放电特性对芯片加工技术的进步至关重要。在本研究中,研究了在CF4放电系统下外部电路对击穿过程的影响,特别关注了等离子体的非线性特性所带来的挑战。结果表明,外电路通过改变等离子体的电场分布、电子密度和温度对放电过程产生显著影响。通过结合匹配电路,在降低电压水平下实现稳定放电。在击穿过程中,由于护套的形成,放电室的电容会大幅增加,从而改变外部电路内电信号的幅度。匹配网络的电容对击穿特性有显著影响。通过选择性地选择不同的电容器,可以实现具有不同特性的击穿。此外,在外电路模型下,不同压力下CF4放电模式的改变和放电模式的改变会影响匹配电路中等离子体的电学特性。这些发现可用于优化CCP的排放及其在表面处理、材料合成和环境修复等方面的应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Influence of external circuitry on CF4 breakdown process in capacitively coupled plasma
Capacitively coupled plasma (CCP) tools are crucial for etching, deposition, and cleaning processes in the semiconductor industry. A comprehensive understanding of their discharge characteristics is vital for the advancement of chip processing technology. In this study, the influence of external circuitry on the breakdown process was investigated under the CF4 discharge system, with a particular focus on challenges presented by the nonlinear nature of the plasma. The results demonstrated that the external circuit significantly affects the discharge process by altering the electric field distribution as well as modifying the electron density and temperature of the plasma. By incorporating the matching circuit, stable discharge was achieved at reduced voltage levels. During breakdown, a substantial increase in the capacitance of the discharge chamber is induced by the formation of the sheath, which alters the amplitude of the electrical signal within the external circuit. The breakdown characteristics are significantly influenced by the capacitance of the matching network. Breakdowns with distinctive characteristics can be achieved by selectively choosing different capacitors. Furthermore, a shift in the CF4 discharge mode at different pressures under the external circuit model and the alteration in the discharge mode affect the electrical properties of the plasma in the matched circuit. These findings could be used to optimize the discharge of CCP and its applications, including surface treatment, material synthesis, and environmental remediation.
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