{"title":"用于微电子的聚合物与硅直接键合","authors":"Margaux Dautriat, Pierre Montméat, Frank Fournel","doi":"10.1149/11203.0051ecst","DOIUrl":null,"url":null,"abstract":"Direct bonding consists in spontaneously bringing into contact two solid surfaces without any intermediate liquid. We focused on silicon direct bonding with polymer films. Direct bonding was evaluated with two polymers: LOR (MicroChem) and BARC (Rohm & Haas), commonly used in photolithography. Polymer bonding by thermal compression was compared to polymer direct bonding. Adhesion energies and bonding wave velocities of bonding between polymers and silicon surfaces were determined. The bonded stacks exhibited good quality bonding interfaces in terms of defects. High adherence energies up to 10 J/m² were measured.","PeriodicalId":11473,"journal":{"name":"ECS Transactions","volume":"30 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-09-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Polymer to Silicon Direct Bonding for Microelectronics\",\"authors\":\"Margaux Dautriat, Pierre Montméat, Frank Fournel\",\"doi\":\"10.1149/11203.0051ecst\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Direct bonding consists in spontaneously bringing into contact two solid surfaces without any intermediate liquid. We focused on silicon direct bonding with polymer films. Direct bonding was evaluated with two polymers: LOR (MicroChem) and BARC (Rohm & Haas), commonly used in photolithography. Polymer bonding by thermal compression was compared to polymer direct bonding. Adhesion energies and bonding wave velocities of bonding between polymers and silicon surfaces were determined. The bonded stacks exhibited good quality bonding interfaces in terms of defects. High adherence energies up to 10 J/m² were measured.\",\"PeriodicalId\":11473,\"journal\":{\"name\":\"ECS Transactions\",\"volume\":\"30 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-09-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ECS Transactions\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1149/11203.0051ecst\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ECS Transactions","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1149/11203.0051ecst","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Polymer to Silicon Direct Bonding for Microelectronics
Direct bonding consists in spontaneously bringing into contact two solid surfaces without any intermediate liquid. We focused on silicon direct bonding with polymer films. Direct bonding was evaluated with two polymers: LOR (MicroChem) and BARC (Rohm & Haas), commonly used in photolithography. Polymer bonding by thermal compression was compared to polymer direct bonding. Adhesion energies and bonding wave velocities of bonding between polymers and silicon surfaces were determined. The bonded stacks exhibited good quality bonding interfaces in terms of defects. High adherence energies up to 10 J/m² were measured.
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