微柱泵浦聚合物环路热管的设计与制造

IF 2.5 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Masaaki Hashimoto;Taiga Kawakami;Abdulkareem Alasli;Ryobu Nomura;Hosei Nagano;Ai Ueno
{"title":"微柱泵浦聚合物环路热管的设计与制造","authors":"Masaaki Hashimoto;Taiga Kawakami;Abdulkareem Alasli;Ryobu Nomura;Hosei Nagano;Ai Ueno","doi":"10.1109/JMEMS.2023.3318413","DOIUrl":null,"url":null,"abstract":"This letter presents a micropillar-pumped polymer loop heat pipe (LHP) with potential applications in flexible electronics. A unique evaporator with a micro pillar wick was designed for a flexible polymer LHP. The polymer LHP was fabricated via simple and cost-effective soft lithography, omitting the need for a porous wick. This design and fabrication approach facilitated passive two-phase cooling in the polymer LHP, with up to 34 °C reduction in evaporator temperature when compared to a non-fluid-charged state in a horizontal orientation. [2023-0140]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"32 6","pages":"519-521"},"PeriodicalIF":2.5000,"publicationDate":"2023-10-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10288587","citationCount":"0","resultStr":"{\"title\":\"Design and Fabrication of a Micropillar-Pumped Polymer Loop Heat Pipe\",\"authors\":\"Masaaki Hashimoto;Taiga Kawakami;Abdulkareem Alasli;Ryobu Nomura;Hosei Nagano;Ai Ueno\",\"doi\":\"10.1109/JMEMS.2023.3318413\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This letter presents a micropillar-pumped polymer loop heat pipe (LHP) with potential applications in flexible electronics. A unique evaporator with a micro pillar wick was designed for a flexible polymer LHP. The polymer LHP was fabricated via simple and cost-effective soft lithography, omitting the need for a porous wick. This design and fabrication approach facilitated passive two-phase cooling in the polymer LHP, with up to 34 °C reduction in evaporator temperature when compared to a non-fluid-charged state in a horizontal orientation. [2023-0140]\",\"PeriodicalId\":16621,\"journal\":{\"name\":\"Journal of Microelectromechanical Systems\",\"volume\":\"32 6\",\"pages\":\"519-521\"},\"PeriodicalIF\":2.5000,\"publicationDate\":\"2023-10-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10288587\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Microelectromechanical Systems\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10288587/\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Microelectromechanical Systems","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10288587/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

摘要

这封信介绍了一种微柱泵浦聚合物环路热管(LHP)在柔性电子产品中的潜在应用。为柔性聚合物LHP设计了一种独特的微柱芯蒸发器。聚合物LHP是通过简单而经济的软光刻技术制造的,省去了多孔芯的需要。这种设计和制造方法促进了聚合物LHP的被动两相冷却,与水平方向的非充液状态相比,蒸发器温度降低了34°C。(2023 - 0140)
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Design and Fabrication of a Micropillar-Pumped Polymer Loop Heat Pipe
This letter presents a micropillar-pumped polymer loop heat pipe (LHP) with potential applications in flexible electronics. A unique evaporator with a micro pillar wick was designed for a flexible polymer LHP. The polymer LHP was fabricated via simple and cost-effective soft lithography, omitting the need for a porous wick. This design and fabrication approach facilitated passive two-phase cooling in the polymer LHP, with up to 34 °C reduction in evaporator temperature when compared to a non-fluid-charged state in a horizontal orientation. [2023-0140]
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来源期刊
Journal of Microelectromechanical Systems
Journal of Microelectromechanical Systems 工程技术-工程:电子与电气
CiteScore
6.20
自引率
7.40%
发文量
115
审稿时长
7.5 months
期刊介绍: The topics of interest include, but are not limited to: devices ranging in size from microns to millimeters, IC-compatible fabrication techniques, other fabrication techniques, measurement of micro phenomena, theoretical results, new materials and designs, micro actuators, micro robots, micro batteries, bearings, wear, reliability, electrical interconnections, micro telemanipulation, and standards appropriate to MEMS. Application examples and application oriented devices in fluidics, optics, bio-medical engineering, etc., are also of central interest.
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