{"title":"单轴拉伸下丝网印刷银墨的电阻网络建模方法","authors":"Justin Chow, Suresh Sitaraman","doi":"10.1115/1.4063485","DOIUrl":null,"url":null,"abstract":"Abstract Flexible electronic devices are used in a wide variety of applications that utilize their unique ability to stretch, bend, and twist. Experimental methods were developed for evaluating the piezoresistive behavior of printed conductive inks under uniaxial strain. DuPont 5025 screen-printed silver ink on Kapton and Melinex substrates was stretched until substrate failure. Kapton samples were found to rupture at around 60% strain and have a relative resistance, R/R0, of about 30–40 at substrate rupture. On Melinex substrates, the ink was found to electrically fail before the substrate ruptured but could be stretched to strains exceeding 130% or higher before failing. The relative resistance values for these high strains in the Melinex samples were erratic and could exceed 1000 and in one case more than 30,000. The ink strain to failure exhibited a dependence on conductor width with narrower conductors failing before wider ones. Finally, a 2.5D RVE model that accounts for ink filler volume fraction, particle size distribution, contact resistance, and electron tunneling was developed that accurately predicts the piezoresistive behavior of 5025 ink up to 60% axial strain. An initial parametric study found that increasing the volume fraction of the RVE results in improved electrical performance.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":"30 1","pages":"0"},"PeriodicalIF":2.2000,"publicationDate":"2023-10-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"The Resistor Network Approach to Modeling Screen-Printed Silver Ink Under Uniaxial Stretch\",\"authors\":\"Justin Chow, Suresh Sitaraman\",\"doi\":\"10.1115/1.4063485\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Abstract Flexible electronic devices are used in a wide variety of applications that utilize their unique ability to stretch, bend, and twist. Experimental methods were developed for evaluating the piezoresistive behavior of printed conductive inks under uniaxial strain. DuPont 5025 screen-printed silver ink on Kapton and Melinex substrates was stretched until substrate failure. Kapton samples were found to rupture at around 60% strain and have a relative resistance, R/R0, of about 30–40 at substrate rupture. On Melinex substrates, the ink was found to electrically fail before the substrate ruptured but could be stretched to strains exceeding 130% or higher before failing. The relative resistance values for these high strains in the Melinex samples were erratic and could exceed 1000 and in one case more than 30,000. The ink strain to failure exhibited a dependence on conductor width with narrower conductors failing before wider ones. Finally, a 2.5D RVE model that accounts for ink filler volume fraction, particle size distribution, contact resistance, and electron tunneling was developed that accurately predicts the piezoresistive behavior of 5025 ink up to 60% axial strain. An initial parametric study found that increasing the volume fraction of the RVE results in improved electrical performance.\",\"PeriodicalId\":15663,\"journal\":{\"name\":\"Journal of Electronic Packaging\",\"volume\":\"30 1\",\"pages\":\"0\"},\"PeriodicalIF\":2.2000,\"publicationDate\":\"2023-10-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Electronic Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1115/1.4063485\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1115/1.4063485","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
The Resistor Network Approach to Modeling Screen-Printed Silver Ink Under Uniaxial Stretch
Abstract Flexible electronic devices are used in a wide variety of applications that utilize their unique ability to stretch, bend, and twist. Experimental methods were developed for evaluating the piezoresistive behavior of printed conductive inks under uniaxial strain. DuPont 5025 screen-printed silver ink on Kapton and Melinex substrates was stretched until substrate failure. Kapton samples were found to rupture at around 60% strain and have a relative resistance, R/R0, of about 30–40 at substrate rupture. On Melinex substrates, the ink was found to electrically fail before the substrate ruptured but could be stretched to strains exceeding 130% or higher before failing. The relative resistance values for these high strains in the Melinex samples were erratic and could exceed 1000 and in one case more than 30,000. The ink strain to failure exhibited a dependence on conductor width with narrower conductors failing before wider ones. Finally, a 2.5D RVE model that accounts for ink filler volume fraction, particle size distribution, contact resistance, and electron tunneling was developed that accurately predicts the piezoresistive behavior of 5025 ink up to 60% axial strain. An initial parametric study found that increasing the volume fraction of the RVE results in improved electrical performance.
期刊介绍:
The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.
Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.