使用 BEOL 电极在 CMOS 嵌入式微流体中进行阻抗传感

IF 2.5 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Wei-Yang Weng;Jun-Chau Chien
{"title":"使用 BEOL 电极在 CMOS 嵌入式微流体中进行阻抗传感","authors":"Wei-Yang Weng;Jun-Chau Chien","doi":"10.1109/JMEMS.2023.3326973","DOIUrl":null,"url":null,"abstract":"This paper describes a novel CMOS-embedded microfluidics platform featuring on-chip impedance-sensing electrodes. The platform employs a single-step wet etching process, removing the CMOS back-end-of-line (BEOL) routing metals, to create hollow fluidic channels that can be closely integrated with active circuits. We optimize the process parameters and improve the etch rate by 10Í through screening different metal etchants and applying hydraulic pressure to enhance the etchant byproduct diffusion rates. To integrate on-chip electrodes for impedance sensing, we explore various strategies and present “via” electrodes that maintain their integrity in the etching process while preserving detection sensitivity. We also investigate the long-term reliability of the platform. Finally, we demonstrate the efficacy of impedance sensing using ionic solutions of varying strengths. [2023-0119]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"33 1","pages":"110-117"},"PeriodicalIF":2.5000,"publicationDate":"2023-11-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Impedance Sensing in CMOS-Embedded Microfluidics Using BEOL Electrodes\",\"authors\":\"Wei-Yang Weng;Jun-Chau Chien\",\"doi\":\"10.1109/JMEMS.2023.3326973\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper describes a novel CMOS-embedded microfluidics platform featuring on-chip impedance-sensing electrodes. The platform employs a single-step wet etching process, removing the CMOS back-end-of-line (BEOL) routing metals, to create hollow fluidic channels that can be closely integrated with active circuits. We optimize the process parameters and improve the etch rate by 10Í through screening different metal etchants and applying hydraulic pressure to enhance the etchant byproduct diffusion rates. To integrate on-chip electrodes for impedance sensing, we explore various strategies and present “via” electrodes that maintain their integrity in the etching process while preserving detection sensitivity. We also investigate the long-term reliability of the platform. Finally, we demonstrate the efficacy of impedance sensing using ionic solutions of varying strengths. [2023-0119]\",\"PeriodicalId\":16621,\"journal\":{\"name\":\"Journal of Microelectromechanical Systems\",\"volume\":\"33 1\",\"pages\":\"110-117\"},\"PeriodicalIF\":2.5000,\"publicationDate\":\"2023-11-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Microelectromechanical Systems\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10308753/\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Microelectromechanical Systems","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10308753/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

摘要

本文介绍了一种新型 CMOS 嵌入式微流体平台,其特点是采用片上阻抗感应电极。该平台采用单步湿法蚀刻工艺,去除 CMOS 后段(BEOL)路由金属,以创建可与有源电路紧密集成的中空流体通道。我们通过筛选不同的金属蚀刻剂和施加液压以提高蚀刻剂副产品的扩散率,优化了工艺参数并将蚀刻率提高了 10Í。为了集成用于阻抗传感的片上电极,我们探索了各种策略,并提出了 "通孔 "电极,可在蚀刻过程中保持其完整性,同时保持检测灵敏度。我们还研究了该平台的长期可靠性。最后,我们展示了使用不同强度的离子溶液进行阻抗传感的功效。[2023-0119]
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Impedance Sensing in CMOS-Embedded Microfluidics Using BEOL Electrodes
This paper describes a novel CMOS-embedded microfluidics platform featuring on-chip impedance-sensing electrodes. The platform employs a single-step wet etching process, removing the CMOS back-end-of-line (BEOL) routing metals, to create hollow fluidic channels that can be closely integrated with active circuits. We optimize the process parameters and improve the etch rate by 10Í through screening different metal etchants and applying hydraulic pressure to enhance the etchant byproduct diffusion rates. To integrate on-chip electrodes for impedance sensing, we explore various strategies and present “via” electrodes that maintain their integrity in the etching process while preserving detection sensitivity. We also investigate the long-term reliability of the platform. Finally, we demonstrate the efficacy of impedance sensing using ionic solutions of varying strengths. [2023-0119]
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
Journal of Microelectromechanical Systems
Journal of Microelectromechanical Systems 工程技术-工程:电子与电气
CiteScore
6.20
自引率
7.40%
发文量
115
审稿时长
7.5 months
期刊介绍: The topics of interest include, but are not limited to: devices ranging in size from microns to millimeters, IC-compatible fabrication techniques, other fabrication techniques, measurement of micro phenomena, theoretical results, new materials and designs, micro actuators, micro robots, micro batteries, bearings, wear, reliability, electrical interconnections, micro telemanipulation, and standards appropriate to MEMS. Application examples and application oriented devices in fluidics, optics, bio-medical engineering, etc., are also of central interest.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信