{"title":"出版人注:“负荷运行时电力转换系统电磁-电热行为评估的动态建模框架”[ASME J. Electron]。Packag。生物医学工程学报,2009,45(2),p. 021005;DOI: 10.1115/1.4055591)","authors":"Erica Hodge","doi":"10.1115/1.4063546","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":"20 1","pages":"0"},"PeriodicalIF":2.2000,"publicationDate":"2023-10-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Publisher's Note: “Dynamic Modeling Framework for Evaluating Electromagnetic- Electro-Thermal Behavior of Power Conversion System During Load Operation” [ASME J. Electron. Packag., 2023, <b>145</b>(2), p. 021005; DOI: 10.1115/1.4055591]\",\"authors\":\"Erica Hodge\",\"doi\":\"10.1115/1.4063546\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":15663,\"journal\":{\"name\":\"Journal of Electronic Packaging\",\"volume\":\"20 1\",\"pages\":\"0\"},\"PeriodicalIF\":2.2000,\"publicationDate\":\"2023-10-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Electronic Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1115/1.4063546\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1115/1.4063546","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Publisher's Note: “Dynamic Modeling Framework for Evaluating Electromagnetic- Electro-Thermal Behavior of Power Conversion System During Load Operation” [ASME J. Electron. Packag., 2023, 145(2), p. 021005; DOI: 10.1115/1.4055591]
期刊介绍:
The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.
Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.