出版人注:“负荷运行时电力转换系统电磁-电热行为评估的动态建模框架”[ASME J. Electron]。Packag。生物医学工程学报,2009,45(2),p. 021005;DOI: 10.1115/1.4055591)

IF 2.2 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Erica Hodge
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Publisher's Note: “Dynamic Modeling Framework for Evaluating Electromagnetic- Electro-Thermal Behavior of Power Conversion System During Load Operation” [ASME J. Electron. Packag., 2023, 145(2), p. 021005; DOI: 10.1115/1.4055591]
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来源期刊
Journal of Electronic Packaging
Journal of Electronic Packaging 工程技术-工程:电子与电气
CiteScore
4.90
自引率
6.20%
发文量
44
审稿时长
3 months
期刊介绍: The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.
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