电压和温度可扩展的门延迟和转换模型,包括门内变化

B. P. Das, Janakiraman Viraraghavan, B. Amrutur, H. S. Jamadagni, N. Arvind
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引用次数: 8

摘要

我们研究了开发一个综合的门延迟和转换模型的可行性,该模型将输出负载、输入边缘转换、电源电压、温度、全局过程变化和局部过程变化都包含在同一个模型中。我们发现标准的多项式模型不能处理如此大的异质输入变量集。我们转而使用神经网络,它以其近似任意连续函数的能力而闻名。我们对工业65nm库的一小部分标准电池门进行的初步实验显示,与SPICE相比,对于覆盖0.9- 1.1 V电源,-40°c至125°c温度,负载,旋转以及全局和局部工艺参数的模型,平均误差小于1%,标准差误差小于3%,最大误差小于11%。将传统库增强为具有相似精度的电压和温度可扩展,平均需要多运行4倍的SPICE表征。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Voltage and Temperature Scalable Gate Delay and Slew Models Including Intra-Gate Variations
We investigate the feasibility of developing a comprehensive gate delay and slew models which incorporates output load, input edge slew, supply voltage, temperature, global process variations and local process variations all in the same model. We find that the standard polynomial models cannot handle such a large heterogeneous set of input variables. We instead use neural networks, which are well known for their ability to approximate any arbitrary continuous function. Our initial experiments with a small subset of standard cell gates of an industrial 65 nm library show promising results with error in mean less than 1%, error in standard deviation less than 3% and maximum error less than 11% as compared to SPICE for models covering 0.9- 1.1 V of supply, -40degC to 125degC of temperature, load, slew and global and local process parameters. Enhancing the conventional libraries to be voltage and temperature scalable with similar accuracy requires on an average 4x more SPICE characterization runs.
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