混合- wsi大规模并行计算模块的成本建模

1993 Proceedings Fifth Annual IEEE International Conference on Wafer Scale Integration Pub Date : 1993-01-20 DOI:10.1109/ICWSI.1993.255268

C. Habiger, R. Lea

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引用次数: 3

摘要

混合晶圆规模集成技术(HWSI)是一种极具经济效益的新一代大规模并行计算机(mpc)开发技术。有人认为，为了确定特定应用程序的最佳技术路线，理解与供应商特定因素相关的相对优点和技术权衡并不容易。介绍了旨在解决这些问题的成本模型，并报告了HWSI器件设计方法的进展

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Cost modelling for hybrid-WSI massively parallel computing modules

Hybrid wafer scale integration (HWSI) is a promising technology for the cost-effective development of the next generation of massively parallel computers (MPCs). It is argued that it is not easy to understand the relative merits and technological tradeoffs associated with vendor-specific factors in order to determine the best technological route for a particular application. Cost models aimed at the resolution of these problems are introduced, and progress towards a design methodology for HWSI devices is reported.<>

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1993 Proceedings Fifth Annual IEEE International Conference on Wafer Scale Integration

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