由电迁移引起的终身关注驱动的设计空间探索

F. Wolff, D. Weyer, C. Papachristou, Steve Clay
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引用次数: 2

摘要

在过去的工艺节点中,寿命并不是集成电路(IC)设计周期的重要因素或主要关注点。生命周期通常是在设计过程的最后作为签字推送的。如果不违反电迁移规则,终身监禁被认为是可以接受的。这种观点正在转变,从什么是允许的,到IC任务概要需要什么。设计师需要知道在任务剖面限制下,在性能、功率和成本方面的终身权衡可以达到多少。本文描述了一种设计空间探索方法,该方法在使用现有技术库的同时,无需重新描述过程,即可将电迁移寿命权衡尽早带入设计周期。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Design Space Exploration Driven by Lifetime Concerns due to Electromigration
Lifetime has not been a significant factor or primary concern in the integrated circuit (IC) design cycle of past process nodes. Lifetime was typically pushed at the end of the design process as signoff. If the electromigration rules weren't violated, lifetime was deemed acceptable. This viewpoint is shifting, from what is allowed, to what the IC mission profile needs. A designer needs to know how much, more or less, lifetime tradeoff with performance, power and cost can be achieved within the mission profile constraints. This paper describes a design space exploration methodology that moves electromigration lifetime tradeoffs early into the design cycle, without the need to re-characterize the process, while working with the existing technology library.
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