{"title":"设计期间开发的高性能CMOS逻辑技术将器件可靠性提高到0.13 /spl mu/m","authors":"D. Nayak, M. Hao, R. Hijab","doi":"10.1109/IRWS.1997.660279","DOIUrl":null,"url":null,"abstract":"During the development of advanced CMOS process technology, the trade-off between high performance and reliability is being made in each generation of technology. In this work, we present these trade-offs as the CMOS devices are scaled from 0.5 /spl mu/m-generation to 0.13 /spl mu/m-generation technology.","PeriodicalId":193522,"journal":{"name":"1997 IEEE International Integrated Reliability Workshop Final Report (Cat. No.97TH8319)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Designing-in device reliability during the development of high-performance CMOS logic technology to 0.13 /spl mu/m\",\"authors\":\"D. Nayak, M. Hao, R. Hijab\",\"doi\":\"10.1109/IRWS.1997.660279\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"During the development of advanced CMOS process technology, the trade-off between high performance and reliability is being made in each generation of technology. In this work, we present these trade-offs as the CMOS devices are scaled from 0.5 /spl mu/m-generation to 0.13 /spl mu/m-generation technology.\",\"PeriodicalId\":193522,\"journal\":{\"name\":\"1997 IEEE International Integrated Reliability Workshop Final Report (Cat. No.97TH8319)\",\"volume\":\"18 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-10-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1997 IEEE International Integrated Reliability Workshop Final Report (Cat. No.97TH8319)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IRWS.1997.660279\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1997 IEEE International Integrated Reliability Workshop Final Report (Cat. No.97TH8319)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRWS.1997.660279","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Designing-in device reliability during the development of high-performance CMOS logic technology to 0.13 /spl mu/m
During the development of advanced CMOS process technology, the trade-off between high performance and reliability is being made in each generation of technology. In this work, we present these trade-offs as the CMOS devices are scaled from 0.5 /spl mu/m-generation to 0.13 /spl mu/m-generation technology.