掺铁和碳缓冲液在GaN hemt中的俘获现象

Kexin Li, T. Matsuda, E. Yagyu, K. Teo, S. Rakheja
{"title":"掺铁和碳缓冲液在GaN hemt中的俘获现象","authors":"Kexin Li, T. Matsuda, E. Yagyu, K. Teo, S. Rakheja","doi":"10.1109/DRC55272.2022.9855817","DOIUrl":null,"url":null,"abstract":"GaN-based high electron mobility transistors (HEMTs) are a promising technology for high-frequency and high-power applications due to their high breakdown strength, superior electron transport characteristics, and their ability to support a large polarization-induced electron concentration. However, reliability issues in GaN HEMTs, such as trap-induced degradation, have drawn considerable attention in both academia and industry. Studies have been carried out on reducing the effect of traps via the optimization of the epitaxial structure of the HEMT. In this work, we focus on extracting and further analyzing the properties of traps in an AlGaN/GaN HEMT, shown in Fig. 1, with a doped GaN buffer. This device is fabricated and characterized at Mitsubishi Electric Corporation (Japan) and additional details regarding experimental methods will be presented elsewhere. The doping profile achieved during the epitaxial growth is shown in Fig. 2. Fe and C doping in the GaN buffer are typically employed to enhance the confinement of the two-dimensional electron gas (2DEG) in the channel and thus reduce buffer leakage [1]. The doping process also introduces traps in the buffer, which are found to be responsible for current collapse (CC) in GaN HEMTs. We analyze the trap characteristics in fabricated AlGaN/GaN HEMTs as a function of C doping in the buffer, while Fe doping concentration is fixed. The activation energy $(E_{A})$ and cross section $(\\sigma)$ of traps in the fabricated devices are extracted from the Arrhenius plot of the drain current transient (DCT) measurements. Similar to previous works, we find that the C doping in GaN layer is mainly responsible for the acceptor-like trapping states with activation around 0.5 eV. We also conduct time-domain simulations of the HEMT using Sentaurus from Synopsys to understand the impact of trap characteristics on the transient response of this device. We conclude that for acceptor-like trapping states with large $E_{A}$ and small $\\sigma$, the current takes longer to recover from CC, while the trap concentration affects the degree of collapse.","PeriodicalId":200504,"journal":{"name":"2022 Device Research Conference (DRC)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-06-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Trapping Phenomena in GaN HEMTs with Fe- and C-doped Buffer\",\"authors\":\"Kexin Li, T. Matsuda, E. Yagyu, K. Teo, S. Rakheja\",\"doi\":\"10.1109/DRC55272.2022.9855817\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"GaN-based high electron mobility transistors (HEMTs) are a promising technology for high-frequency and high-power applications due to their high breakdown strength, superior electron transport characteristics, and their ability to support a large polarization-induced electron concentration. However, reliability issues in GaN HEMTs, such as trap-induced degradation, have drawn considerable attention in both academia and industry. Studies have been carried out on reducing the effect of traps via the optimization of the epitaxial structure of the HEMT. In this work, we focus on extracting and further analyzing the properties of traps in an AlGaN/GaN HEMT, shown in Fig. 1, with a doped GaN buffer. This device is fabricated and characterized at Mitsubishi Electric Corporation (Japan) and additional details regarding experimental methods will be presented elsewhere. The doping profile achieved during the epitaxial growth is shown in Fig. 2. Fe and C doping in the GaN buffer are typically employed to enhance the confinement of the two-dimensional electron gas (2DEG) in the channel and thus reduce buffer leakage [1]. The doping process also introduces traps in the buffer, which are found to be responsible for current collapse (CC) in GaN HEMTs. We analyze the trap characteristics in fabricated AlGaN/GaN HEMTs as a function of C doping in the buffer, while Fe doping concentration is fixed. The activation energy $(E_{A})$ and cross section $(\\\\sigma)$ of traps in the fabricated devices are extracted from the Arrhenius plot of the drain current transient (DCT) measurements. Similar to previous works, we find that the C doping in GaN layer is mainly responsible for the acceptor-like trapping states with activation around 0.5 eV. We also conduct time-domain simulations of the HEMT using Sentaurus from Synopsys to understand the impact of trap characteristics on the transient response of this device. We conclude that for acceptor-like trapping states with large $E_{A}$ and small $\\\\sigma$, the current takes longer to recover from CC, while the trap concentration affects the degree of collapse.\",\"PeriodicalId\":200504,\"journal\":{\"name\":\"2022 Device Research Conference (DRC)\",\"volume\":\"2 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-06-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 Device Research Conference (DRC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/DRC55272.2022.9855817\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 Device Research Conference (DRC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/DRC55272.2022.9855817","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

基于氮化镓的高电子迁移率晶体管(hemt)由于其高击穿强度、优越的电子传输特性以及支持大极化诱导电子浓度的能力,在高频和高功率应用中是一种很有前途的技术。然而,GaN hemt的可靠性问题,如陷阱引起的退化,已经引起了学术界和工业界的广泛关注。研究人员通过优化HEMT的外延结构来降低陷阱的影响。在这项工作中,我们专注于提取和进一步分析图1中掺杂GaN缓冲液的AlGaN/GaN HEMT中的陷阱特性。该装置是在三菱电机公司(日本)制造和表征的,有关实验方法的更多细节将在其他地方介绍。在外延生长过程中获得的掺杂曲线如图2所示。在GaN缓冲液中掺杂Fe和C通常用于增强通道中二维电子气(2DEG)的约束,从而减少缓冲液泄漏[1]。掺杂过程还在缓冲液中引入了陷阱,这些陷阱被发现是GaN hemt中电流崩溃(CC)的原因。我们分析了制备的AlGaN/GaN hemt的陷阱特性,作为缓冲液中C掺杂的函数,而Fe掺杂浓度是固定的。从漏极电流瞬态(DCT)测量的Arrhenius图中提取了器件中陷阱的活化能$(E_{A})$和横截面$(\sigma)$。与之前的研究相似,我们发现氮化镓层中的C掺杂是导致激活在0.5 eV左右的类受体捕获态的主要原因。我们还利用Synopsys的Sentaurus进行了HEMT的时域模拟,以了解陷阱特性对该器件瞬态响应的影响。我们得出结论,对于具有较大的$E_{A}$和较小的$\sigma$的类受体捕获态,电流从CC恢复所需的时间更长,而陷阱浓度影响崩溃程度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Trapping Phenomena in GaN HEMTs with Fe- and C-doped Buffer
GaN-based high electron mobility transistors (HEMTs) are a promising technology for high-frequency and high-power applications due to their high breakdown strength, superior electron transport characteristics, and their ability to support a large polarization-induced electron concentration. However, reliability issues in GaN HEMTs, such as trap-induced degradation, have drawn considerable attention in both academia and industry. Studies have been carried out on reducing the effect of traps via the optimization of the epitaxial structure of the HEMT. In this work, we focus on extracting and further analyzing the properties of traps in an AlGaN/GaN HEMT, shown in Fig. 1, with a doped GaN buffer. This device is fabricated and characterized at Mitsubishi Electric Corporation (Japan) and additional details regarding experimental methods will be presented elsewhere. The doping profile achieved during the epitaxial growth is shown in Fig. 2. Fe and C doping in the GaN buffer are typically employed to enhance the confinement of the two-dimensional electron gas (2DEG) in the channel and thus reduce buffer leakage [1]. The doping process also introduces traps in the buffer, which are found to be responsible for current collapse (CC) in GaN HEMTs. We analyze the trap characteristics in fabricated AlGaN/GaN HEMTs as a function of C doping in the buffer, while Fe doping concentration is fixed. The activation energy $(E_{A})$ and cross section $(\sigma)$ of traps in the fabricated devices are extracted from the Arrhenius plot of the drain current transient (DCT) measurements. Similar to previous works, we find that the C doping in GaN layer is mainly responsible for the acceptor-like trapping states with activation around 0.5 eV. We also conduct time-domain simulations of the HEMT using Sentaurus from Synopsys to understand the impact of trap characteristics on the transient response of this device. We conclude that for acceptor-like trapping states with large $E_{A}$ and small $\sigma$, the current takes longer to recover from CC, while the trap concentration affects the degree of collapse.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信