Remaining useful life prediction of MEMS sensors used in automotive under random vibration loading

The Micro-Electro-Mechanical Systems (MEMS, such as gyros or accelerometers) applied in modern automotive usually work in relatively critical environmental conditions, such as random vibration, shock/high impact, and extreme temperature. The package and interconnection of MEMS are critical concerns that influence the reliability and performance of MEMS sensors. This paper focuses on a prediction methodology based on finite element analysis and random vibration simulation to study the reliability and the remaining useful life prediction of package and interconnection of MEMS. The results show that solder joint is the weakest link which is subject to fatigue failures. Damage accumulation for multiple vibration loadings was calculated using Miner's rule. The method for remaining useful life prediction is discussed.