{"title":"使用PGA370插座实现800 MT/s的性能","authors":"C. Chung, A. Waizman","doi":"10.1109/EPEP.1999.819209","DOIUrl":null,"url":null,"abstract":"This paper describes the innovative solutions that enabled the implementation of high speed I/O (800 MT/s) performance for an integrated RDRAM controller on an Intel Celeron CPU, under low cost constraints of packaging, socket-able solution and 4-layer motherboard.","PeriodicalId":299335,"journal":{"name":"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)","volume":"91 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Achieving 800 MT/s performance with PGA370 socket\",\"authors\":\"C. Chung, A. Waizman\",\"doi\":\"10.1109/EPEP.1999.819209\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper describes the innovative solutions that enabled the implementation of high speed I/O (800 MT/s) performance for an integrated RDRAM controller on an Intel Celeron CPU, under low cost constraints of packaging, socket-able solution and 4-layer motherboard.\",\"PeriodicalId\":299335,\"journal\":{\"name\":\"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)\",\"volume\":\"91 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1999-10-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.1999.819209\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.1999.819209","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
This paper describes the innovative solutions that enabled the implementation of high speed I/O (800 MT/s) performance for an integrated RDRAM controller on an Intel Celeron CPU, under low cost constraints of packaging, socket-able solution and 4-layer motherboard.