{"title":"微系统技术:缩小太阳传感器的方法","authors":"J. Leijtens, K. Boom, N. V. D. Heiden","doi":"10.1109/ICMENS.2005.68","DOIUrl":null,"url":null,"abstract":"High reliability sun sensors are currently built using silicon detectors and aperture masks which are supported at an accurate distance above the sensitive detector surface. By using micro systems technologies like bulk and surface micro machining and wafer level bonding, highly precise and accurate sensors can be devised that are expected to have comparable performance but much smaller dimensions and mass.","PeriodicalId":185824,"journal":{"name":"2005 International Conference on MEMS,NANO and Smart Systems","volume":"19 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-07-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Micro systems technology: the way to shrink sun sensors\",\"authors\":\"J. Leijtens, K. Boom, N. V. D. Heiden\",\"doi\":\"10.1109/ICMENS.2005.68\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"High reliability sun sensors are currently built using silicon detectors and aperture masks which are supported at an accurate distance above the sensitive detector surface. By using micro systems technologies like bulk and surface micro machining and wafer level bonding, highly precise and accurate sensors can be devised that are expected to have comparable performance but much smaller dimensions and mass.\",\"PeriodicalId\":185824,\"journal\":{\"name\":\"2005 International Conference on MEMS,NANO and Smart Systems\",\"volume\":\"19 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-07-24\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2005 International Conference on MEMS,NANO and Smart Systems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICMENS.2005.68\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2005 International Conference on MEMS,NANO and Smart Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMENS.2005.68","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Micro systems technology: the way to shrink sun sensors
High reliability sun sensors are currently built using silicon detectors and aperture masks which are supported at an accurate distance above the sensitive detector surface. By using micro systems technologies like bulk and surface micro machining and wafer level bonding, highly precise and accurate sensors can be devised that are expected to have comparable performance but much smaller dimensions and mass.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
