{"title":"用于IC器件的新型可丝网印刷聚酰亚胺","authors":"H. Nishizawa, K. Suzuki, T. Kikuchi, H. Satou","doi":"10.1109/ECTC.1990.122268","DOIUrl":null,"url":null,"abstract":"In order to develop a screen-printable polyimide paste, the structures, properties, and ratios of three major paste components (filler, binder, and solvent) were studied, and a film-forming strategy was established. This strategy comprises a novel type of polyimide particle filler, which can be dissolved in the binder and the solvent under the curing condition. A screen-printable polyimide paste was developed using this strategy. This paste gives uniform film with better mechanical properties than conventional polyimide paste, which comprises an insoluble polyimide particle filler. The effect of the solubility parameter of the solvent on mask swelling and moisture resistance was also examined. It was also examined. It was found that a lactone with a solubility parameter value of 18 approximately 20 (MJ/m/sup 3/)/sup 1/2/ is suitable as a paste solvent. The paste affords uniform pinhole-free polyimide films with good mechanical properties. As the mask swelling is low, the lifetime of stencil is longer than that of conventional pastes.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"New screen-printable polyimide for IC devices\",\"authors\":\"H. Nishizawa, K. Suzuki, T. Kikuchi, H. Satou\",\"doi\":\"10.1109/ECTC.1990.122268\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In order to develop a screen-printable polyimide paste, the structures, properties, and ratios of three major paste components (filler, binder, and solvent) were studied, and a film-forming strategy was established. This strategy comprises a novel type of polyimide particle filler, which can be dissolved in the binder and the solvent under the curing condition. A screen-printable polyimide paste was developed using this strategy. This paste gives uniform film with better mechanical properties than conventional polyimide paste, which comprises an insoluble polyimide particle filler. The effect of the solubility parameter of the solvent on mask swelling and moisture resistance was also examined. It was also examined. It was found that a lactone with a solubility parameter value of 18 approximately 20 (MJ/m/sup 3/)/sup 1/2/ is suitable as a paste solvent. The paste affords uniform pinhole-free polyimide films with good mechanical properties. As the mask swelling is low, the lifetime of stencil is longer than that of conventional pastes.<<ETX>>\",\"PeriodicalId\":102875,\"journal\":{\"name\":\"40th Conference Proceedings on Electronic Components and Technology\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1990-05-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"40th Conference Proceedings on Electronic Components and Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.1990.122268\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"40th Conference Proceedings on Electronic Components and Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1990.122268","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
In order to develop a screen-printable polyimide paste, the structures, properties, and ratios of three major paste components (filler, binder, and solvent) were studied, and a film-forming strategy was established. This strategy comprises a novel type of polyimide particle filler, which can be dissolved in the binder and the solvent under the curing condition. A screen-printable polyimide paste was developed using this strategy. This paste gives uniform film with better mechanical properties than conventional polyimide paste, which comprises an insoluble polyimide particle filler. The effect of the solubility parameter of the solvent on mask swelling and moisture resistance was also examined. It was also examined. It was found that a lactone with a solubility parameter value of 18 approximately 20 (MJ/m/sup 3/)/sup 1/2/ is suitable as a paste solvent. The paste affords uniform pinhole-free polyimide films with good mechanical properties. As the mask swelling is low, the lifetime of stencil is longer than that of conventional pastes.<>
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
