银微粒增强锡锌基复合钎料的研究

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) Pub Date : 2008-11-01 DOI:10.1109/IEMT.2008.5507806

S. Das, A. Sharif

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引用次数: 0

摘要

本文研究了在Sn-Zn共晶体系中，在0-4.0 wt.%范围内添加Ag对复合钎料的显微组织、力学性能和热行为的影响。系统研究了Au/Ni/Cu球栅阵列(BGA)焊盘金属化后Sn-Zn微复合共晶焊料的剪切强度和界面反应。在Au/电解Ni/Cu焊盘与Sn-Zn复合合金的焊点界面处形成了三个不同的金属间化合物(IMC)层。在Sn-Zn钎料中添加的Ag颗粒越多，形成的Ag- zn化合物越多，使最上层的IMC层变厚。在初始形成的界面Au-Zn IMC层上重新沉积的大块焊料中形成的溶解的Ag-Zn IMC阻止了整个IMC层从焊盘表面升起。界面的横截面研究也与断裂面进行了关联。

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A study of Ag micro-particle reinforced Sn-Zn matrix composite solder

In this work, Ag micro-particles content in the range between 0-4.0 wt.% with Sn-Zn eutectic system, were examined in order to understand the effect of Ag addition on the microstructural and mechanical properties as well as the thermal behavior of the composite solders. The shear strengths and the interfacial reactions of Sn-Zn micro-composite eutectic solders with Au/Ni/Cu ball grid array (BGA) pad metallization were systematically investigated. The three distinct intermetallic compound (IMC) layers were formed at the solder interface of the Au/electrolytic Ni/Cu bond pad with Sn-Zn composite alloys. The more Ag particles added to the Sn-Zn solder, the more Ag-Zn compound formed to thicken the uppermost IMC layer. The dissoluted Ag-Zn IMCs formed in the bulk solder redeposited over the initially formed interfacial Au-Zn IMC layer, prevented the whole IMC layer lift-off from the pad surface. Cross-sectional studies of the interfaces were also conducted to correlate with the fracture surfaces.

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2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)

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