Next generation imprint equipment for patterning high quality micro-optical elements

Micro-optics are in great demand and indispensable key enabling elements in various emerging markets. High quality wafer-level micro-optics attract huge commercial interest in prestigious applications like 3D sensing and imaging for AR/VR in smart devices and automotive lighting [1]. The consumers aspire to have comprehensive functionalities on their smart gadgets, to enhance their view of the real environment by superimposing a virtual world. 3D sensing cameras with Time-of-Flight (ToF) modules provide a revolutionary virtual reality and imaging. A typical ToF module demands various highly efficient nano and micro-optical elements [2,3]. The next generation imprint equipment provided by SUSS MicroTec offers a versatile and sophisticated imprint mechanism to resolve complex microscale structures on a single imprint equipment. The advanced technical features include enhanced imprint gap measurement and a levelling mechanism, tunable forces during imprint, advanced design of microscopes for high alignment accuracy and cost-effective UV-LED flood exposure with high intensities. These comprehensive functionalities also make it possible to manufacture larger sets of stacked micro lens arrays with low aberration and minimal distortion of lens geometry. In this talk, we will present the capabilities of SUSS equipment for imprinting micro lens arrays (MLA) with alignment accuracy ≤ 1μm and less geometry variation < 1 %, over a 200 mm wafer surface. Moreover, in a high volume manufacturing environment, key to productivity are consistent and repeatable fabrication processes and operations. Therefore, we will also show the reliability of our equipment and the repeatability of producing high quality MLAs.