微波过程中印刷电路板结构的保护

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2013-04-14 DOI:10.1109/EUROSIME.2013.6529917

T. D. Bui, F. Bremerkamp, M. Nowottnick, D. Seehase

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引用次数: 0

摘要

作为一种理论预测，对PCB结构在微波过程中的保护进行了仿真，取得了成功。除非所有导线的结构穿过极化，否则天线效应将站在电介质上。导电屏蔽可以局部使用，也可以全部使用。通过增加涂层介电常数的虚部，介质加热可以控制天线效应。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Protection of printed circuit board structures in microwave process

As a theoretical prediction the simulations of protection of PCB structures in microwave process are successful. Unless the structure with all wires crosses the polarization, the antenna effect will stand over the dielectric. Conductive shields can be used locally or totally. By increasing the imaginary part of the permitivity of the coating, the dielectric heating can dominate the antenna effect.

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2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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