铁电去耦电容器陶瓷封装

[Proceedings] 1990 IEEE 7th International Symposium on Applications of Ferroelectrics Pub Date : 1990-06-06 DOI:10.1109/ISAF.1990.200193

R. Tummala, C. Eggerding

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引用次数: 4

摘要

封装是陶瓷在微电子领域最重要的应用。总结了陶瓷的持续发展和最先进的衬底制造工艺。描述了一种分立的铁电去耦电容器，提供非常低的电感，以最小化陶瓷封装的δ - i噪声。

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Ceramics packaging with ferroelectric decoupling capacitor

Packaging is the most important application of ceramics in microelectronics. The continued evolution of ceramics and the processes with which the most advanced substrates will be fabricated are summarized. A discrete ferroelectric decoupling capacitor providing very low inductance to minimize the delta-I noise of ceramic packages is described.<>

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来源期刊

[Proceedings] 1990 IEEE 7th International Symposium on Applications of Ferroelectrics

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