微辐射热计中包含像素级ADC的读出集成电路

2008 International SoC Design Conference Pub Date : 2008-11-01 DOI:10.1109/SOCDC.2008.4815754

C. Hwang, H.C. Lee

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引用次数: 1

摘要

研究了用于320 × 240微辐射热计焦平面阵列(fpa)的包含像素级模数转换器(ADC)的读出集成电路。每个2times2像素共享一个读出电路，包括一个运算放大器(运放)、一个集成电容和一个单斜率ADC。该读出电路设计为在0.35 μ m 2-poly - 3-metal CMOS技术中实现35倍35 μ m2像素尺寸。

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Readout integrated circuits involving pixel-level ADC for microbolometers

Readout integrated circuits involving a pixel-level analog-to-digital converter (ADC) are studied for 320 times 240 microbolometer focal plane arrays (FPAs). Each 2times2 pixel shares an readout circuit, including an operational amplifier(op-Amp), an integration capacitor and a single slope ADC. This readout circuit is designed to achieve 35 times 35 mum2 pixel size in 0.35 mum 2-poly 3-metal CMOS technology.

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2008 International SoC Design Conference

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