纳米线mosfet: rf特性及应用

L. Wernersson
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引用次数: 1

摘要

III-V型mosfet在缩放栅极长度时提供更好的静电控制,同时显著降低栅极泄漏电流。随着晶体管的自然演变,我们研究了垂直III-V纳米线mosfet,并在Si衬底上集成了gm>3 S/mm的mosfet。对动态特性的仔细研究表明,在20 GHz时,小信号III-V MOSFET模型的msg值高达14.5 dB,其中还包括与高k薄膜内缺陷相关的陷阱响应。从1/f -调查中,我们确定了栅极堆中缺陷的分布,并在导带边缘附近找到了一个局部最小值,其Nbt介于1018和1019 cm−3 eV−1之间。III-V纳米线mosfet用于设计具有竞争性能的d波段lna。它们还显示出pmosfet, tfet和RRAM元件集成的希望,开辟了广泛的应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
III-V Nanowire MOSFETs: RF-Properties and Applications
III-V MOSFETs provide improved electrostatic control at scaled gate lengths combined with a considerable reduction in gate leakage current. Following the natural transistor evolution, we investigate vertical III-V nanowire MOSFETs and fabricate MOSFETs with gm>3 S/mm integrated on Si substrates. Careful investigations of the dynamic properties show high MSG-value of 14.5 dB at 20 GHz with a small-signal III-V MOSFET model including also trap response related to defects within the high-k film. From 1/f -investigations we determine the distribution of defects in the gate-stack and find a local minimum around the conduction band edge with a Nbt between mid-1018 and mid-1019 cm−3 eV−1. The III-V nanowire MOSFETs are used to design D-band LNAs with competitive performance. They also show promise for integration of pMOSFETs, TFETs, and RRAM elements opening a wide range of applications.
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