基于破坏性故障隔离的有效后端缺陷定位

2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Pub Date : 2022-07-18 DOI:10.1109/IPFA55383.2022.9915770

Siew Ming Lim, Jack Yi Jie Ng

{"title":"基于破坏性故障隔离的有效后端缺陷定位","authors":"Siew Ming Lim, Jack Yi Jie Ng","doi":"10.1109/IPFA55383.2022.9915770","DOIUrl":null,"url":null,"abstract":"Nanoprobing has become increasingly important for die level failure analysis as the industry moves towards smaller geometry over the years. This paper presents two case studies on Field Programmable Grid Array (FPGA) failure to demonstrate a destructive fault isolation methodology with the combination of delayering and nanoprobing in physical failure analysis","PeriodicalId":378702,"journal":{"name":"2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-07-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Effective Backend Defect Localization by Destructive Fault Isolation\",\"authors\":\"Siew Ming Lim, Jack Yi Jie Ng\",\"doi\":\"10.1109/IPFA55383.2022.9915770\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Nanoprobing has become increasingly important for die level failure analysis as the industry moves towards smaller geometry over the years. This paper presents two case studies on Field Programmable Grid Array (FPGA) failure to demonstrate a destructive fault isolation methodology with the combination of delayering and nanoprobing in physical failure analysis\",\"PeriodicalId\":378702,\"journal\":{\"name\":\"2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"volume\":\"4 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-07-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA55383.2022.9915770\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA55383.2022.9915770","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

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摘要

随着工业多年来向更小的几何形状发展，纳米探测对于模具级失效分析变得越来越重要。本文介绍了现场可编程网格阵列(FPGA)故障的两个案例研究，以展示在物理故障分析中结合分层和纳米探测的破坏性故障隔离方法

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Effective Backend Defect Localization by Destructive Fault Isolation

Nanoprobing has become increasingly important for die level failure analysis as the industry moves towards smaller geometry over the years. This paper presents two case studies on Field Programmable Grid Array (FPGA) failure to demonstrate a destructive fault isolation methodology with the combination of delayering and nanoprobing in physical failure analysis

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2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

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