K. Petrosyants, L. Sambursky, I. Kharitonov, B. Lvov
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引用次数: 5
摘要
提出了辐射硬化SOI CMOS集成电路环境诱发故障的建模与仿真方法。为此,使用了考虑TID、剂量率和单事件效应的通用紧凑SPICE SOI MOSFET模型。首先,考虑到新型辐射硬化SOI MOS结构的辐射效应和特性,详细描述了模型参数的提取过程。模拟和数字SOI CMOS电路的仿真结果表明,对于各种类型的辐射,与实验数据的差异不超过10-20%。
Fault simulation in radiation-hardened SOI CMOS VLSIs using universal compact MOSFET model
The methodology of modeling and simulation of environmentally induced faults in radiation hardened SOI CMOS ICs is presented. For this purpose, the universal compact SPICE SOI MOSFET model with account for TID, dose rate and single event effects is used. First, the model parameters extraction procedure is described in more details taking into consideration radiation effects and peculiarities of novel radiation-hardened (RH) SOI MOS structures. The results of analog and digital SOI CMOS circuits simulation show the difference with experimental data not more than 10-20% for all types of radiation.