基于端接结构的700V超结VDMOS反向恢复特性优化

Yibing Wang, M. Qiao, Jue Li, Ruidi Wang, Bo Zhang
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引用次数: 0

摘要

在这项工作中,我们提出了一个在终端区具有p型横向连接(LC)层的700V超结垂直双扩散MOSFET (SJ VDMOS)。通过改变LC层的掺杂浓度,可以有效地调节反向回收特性。p型LC层掺杂浓度越低,在恢复期间终止结构的耗尽边界附近保留更多的内部空穴,导致恢复电流下降越慢。而p型LC层的掺杂浓度对反向周期没有影响。利用这种优化方法,我们在多外延/多植入平台上进行了实验。实验装置实现比导通电阻12.09 m Ω。cm2,击穿电压719v。实验结果与仿真结果吻合较好。仿真和实验结果验证了该方法的有效性和可行性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Optimization of Reverse Recovery Characteristics Based on Termination Structure for 700V Super-Junction VDMOS
In this work, we propose a 700V super-junction vertical double-diffused MOSFET (SJ VDMOS) with P-type lateral connection (LC) layer in the termination region. By changing the doping concentration of the LC layer, we can effectively adjust the reverse recovery characteristics. More internal holes remain near the depletion boundary for the termination structure with lower P-type LC layer doping concentration during the recovery period, leading to slower recovery current drop. However, the doping concentration of P-type LC layer does not affect the reverse period. Using this optimization method, we conduct experiments based on a multi-epitaxy/multi-implant platform. The experimental device realizes specific on-resistance of 12.09 m Ω.cm2 and breakdown voltage of 719 V. The experimental results are in good consistence with the simulated results. Both simulated and experimental results validate the effectiveness and feasibility of the proposed method.
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