Ming-Jiang Zhou, A. de Bruycker, A. Van Calster, J. Witters
{"title":"采用BICMOS技术高压植入RESURF - ldmos","authors":"Ming-Jiang Zhou, A. de Bruycker, A. Van Calster, J. Witters","doi":"10.1109/DRC.1993.1009607","DOIUrl":null,"url":null,"abstract":"Summary form only given. The authors present a complementary RESURF p-LDMOS in which the n/sup +/ buried layer is used as an effective substrate and a field implant is introduced to modify the drift charges. The implant conditions in this case, particularly the placements, are studied. After processing, V/sub B/ are investigated with different implant placement (L/sub A/, L/sub B/) and field oxide lengths L/sub F/. It is found that although the ion implant covers part of the drift region, the device performance can still be greatly improved. Results show that a long enough implant, compatible with L/sub F/, under the field oxide can result in the maximum, V/sub B/=V/sub BP/. This is verified by simulation results, which show that the peak of the surface electric field is significantly reduced. Results also show that a full length (L/sub F/) implantation under the field oxide can result in the minimum R/sub on/ for a fixed L/sub F/. >","PeriodicalId":310841,"journal":{"name":"51st Annual Device Research Conference","volume":"7 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"High voltage implanted RESURF p-LDMOS using BICMOS technology\",\"authors\":\"Ming-Jiang Zhou, A. de Bruycker, A. Van Calster, J. Witters\",\"doi\":\"10.1109/DRC.1993.1009607\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Summary form only given. The authors present a complementary RESURF p-LDMOS in which the n/sup +/ buried layer is used as an effective substrate and a field implant is introduced to modify the drift charges. The implant conditions in this case, particularly the placements, are studied. After processing, V/sub B/ are investigated with different implant placement (L/sub A/, L/sub B/) and field oxide lengths L/sub F/. It is found that although the ion implant covers part of the drift region, the device performance can still be greatly improved. Results show that a long enough implant, compatible with L/sub F/, under the field oxide can result in the maximum, V/sub B/=V/sub BP/. This is verified by simulation results, which show that the peak of the surface electric field is significantly reduced. Results also show that a full length (L/sub F/) implantation under the field oxide can result in the minimum R/sub on/ for a fixed L/sub F/. >\",\"PeriodicalId\":310841,\"journal\":{\"name\":\"51st Annual Device Research Conference\",\"volume\":\"7 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-06-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"51st Annual Device Research Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/DRC.1993.1009607\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"51st Annual Device Research Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/DRC.1993.1009607","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
High voltage implanted RESURF p-LDMOS using BICMOS technology
Summary form only given. The authors present a complementary RESURF p-LDMOS in which the n/sup +/ buried layer is used as an effective substrate and a field implant is introduced to modify the drift charges. The implant conditions in this case, particularly the placements, are studied. After processing, V/sub B/ are investigated with different implant placement (L/sub A/, L/sub B/) and field oxide lengths L/sub F/. It is found that although the ion implant covers part of the drift region, the device performance can still be greatly improved. Results show that a long enough implant, compatible with L/sub F/, under the field oxide can result in the maximum, V/sub B/=V/sub BP/. This is verified by simulation results, which show that the peak of the surface electric field is significantly reduced. Results also show that a full length (L/sub F/) implantation under the field oxide can result in the minimum R/sub on/ for a fixed L/sub F/. >