{"title":"区域分解在平面多层互连结构及集成无源有限元电磁建模中的应用","authors":"Hong Wu, A. Cangellaris, A. Kuo","doi":"10.1109/EPEP.2004.1407610","DOIUrl":null,"url":null,"abstract":"A domain-decomposition assisted finite element modeling methodology is implemented for broadband electromagnetic modeling of multilayered interconnects and integrated passives. The proposed methodology is aimed at tackling the modeling complexity of the high-density multi-layer signal wiring environment encountered in state-of-the-art packages for high-speed digital and mixed-signal integrated circuits.","PeriodicalId":143349,"journal":{"name":"Electrical Performance of Electronic Packaging - 2004","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Application of domain decomposition to the finite-element electromagnetic modeling of planar multi-layered interconnect structures & integrated passives\",\"authors\":\"Hong Wu, A. Cangellaris, A. Kuo\",\"doi\":\"10.1109/EPEP.2004.1407610\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A domain-decomposition assisted finite element modeling methodology is implemented for broadband electromagnetic modeling of multilayered interconnects and integrated passives. The proposed methodology is aimed at tackling the modeling complexity of the high-density multi-layer signal wiring environment encountered in state-of-the-art packages for high-speed digital and mixed-signal integrated circuits.\",\"PeriodicalId\":143349,\"journal\":{\"name\":\"Electrical Performance of Electronic Packaging - 2004\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-10-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Electrical Performance of Electronic Packaging - 2004\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.2004.1407610\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electronic Packaging - 2004","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2004.1407610","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Application of domain decomposition to the finite-element electromagnetic modeling of planar multi-layered interconnect structures & integrated passives
A domain-decomposition assisted finite element modeling methodology is implemented for broadband electromagnetic modeling of multilayered interconnects and integrated passives. The proposed methodology is aimed at tackling the modeling complexity of the high-density multi-layer signal wiring environment encountered in state-of-the-art packages for high-speed digital and mixed-signal integrated circuits.
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