固定轮廓多弯总线驱动平面规划

Wenxu Sheng, Sheqin Dong, Yuliang Wu, S. Goto
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引用次数: 2

摘要

现代分层SOC设计流程需要处理互连约束下的固定轮廓平面规划问题,本文研究了固定轮廓区域的总线驱动平面规划问题。给定一组块、总线规格以及芯片区域的高度和宽度,将生成包含总线路线并满足轮廓约束的平面方案,使总平面面积和总总线面积最小。本文提出的方法基于一种确定性算法LFF (Less Flexibility First),该算法在固定轮廓区域内运行,并将硬块逐个打包,没有任何缺陷。在我们的方法中,我们对总线的形状没有限制,并且块封装和总线封装的过程是同时进行的。实验结果表明,在固定轮廓的约束下,我们也可以得到一个很好的解,死区百分比小,运行时间短,并且对于大型测试用例,我们的算法仍然可以很好地工作。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Fixed outline multi-bend bus driven floorplanning
Modern hierarchical SOC design flows need to deal with fixed-outline floorplanning under the interconnect constraints, in this paper, we address the problem of bus driven floorplanning in a fixed-outline area. Given a set of blocks, the bus specification, and the height and width of the chip area, a floorplan solution including bus routes and satisfying the outline constraint will be generated with the total floorplan area and total bus area minimized. The approach proposed in this paper is based on a deterministic algorithm Less Flexibility First (LFF), which runs in a fixed-outline area and packs hard blocks one after another with no drawbacks. In our approach, we put no limitation to the shape of the buses, and the processes block-packing and bus-packing are proceeding simultaneously. Experiment results show that under the constraint of fixed-outline, we can also obtain a good solution, with less dead space percentage and shorter run time, besides, for large test cases, our algorithm still works well.
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