一种采用本体微加工技术的新型折射率硅微透镜阵列

Choon-Sup Lee, Chul‐Hi Han
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引用次数: 33

摘要

为了提高红外探测器的探测能力,我们提出了一种新型的硅微透镜阵列。利用了EDP蚀刻剂中硼密度对硼扩散和蚀刻选择性的影响。与传统的微透镜不同,该透镜的焦距可以通过扩散温度/时间和扩散窗口等参数来控制。在实验中,通过在0 - 8小时之间改变驱动时间,可以将焦距控制在70%以内。实测焦斑尺寸为3.8 /spl mu/m,理论衍射极限焦斑尺寸为3.3 /spl mu/m。采用SiO/sub - 2/图图化可以制备任意形状的微透镜。由于自停止特性,峰间表面粗糙度较低,约为40 nm。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A novel refractive silicon microlens array using bulk micromachining technology
We propose a novel Si microlens array for enhancing the detectivity of IR detector using bulk micromachining technology. Boron diffusion and etching selectivity with respect to boron density in EDP etchant are utilized. Unlike conventional microlens, the focal length can be easily controlled with diffusion parameters such as diffusion temperature/time and diffusion window. In the experiment, the focal length can be controlled within 70% by varying the drive-in time between 0 and 8 hours. The measured focal spot size is 3.8 /spl mu/m of which a theoretical diffraction-limited spot size is 3.3 /spl mu/m. Arbitrary shaped-microlens can be fabricated by SiO/sub 2/ patterning. The peak-to-peak surface roughness is low, about 40 nm, due to self-stopping property.
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