{"title":"基于室温沉积介质的硅纳米带高性能印刷场效应管","authors":"Ayoub Zumeit, D. Shakthivel, R. Dahiya","doi":"10.1109/FLEPS49123.2020.9239533","DOIUrl":null,"url":null,"abstract":"This paper presents the fabrication and characterization of transfer printed Si nanoribbons (NRs) based field effect transistor (NRFETs). The critical steps such as high-k gate dielectric (silicon nitride (SiN)) were carried out at room temperature (RT), by using inductively coupled plasma chemical vapour deposition (ICP-CVD) method. The presented device exhibit mobility (~ 656 cm2 V−1.s−1) and On/Off ratio (>106) at par with conventional Si devices. The fabricated flexible Si NRFETs were evaluated under multiple bending cycles (~100) and the performance was found to be stable. The presented approach demonstrates the potential for direct printing of high performance flexible electronics.","PeriodicalId":101496,"journal":{"name":"2020 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"187 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-08-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Si Nanoribbons based High Performance Printed FETs using Room-Temperature deposited Dielectric\",\"authors\":\"Ayoub Zumeit, D. Shakthivel, R. Dahiya\",\"doi\":\"10.1109/FLEPS49123.2020.9239533\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents the fabrication and characterization of transfer printed Si nanoribbons (NRs) based field effect transistor (NRFETs). The critical steps such as high-k gate dielectric (silicon nitride (SiN)) were carried out at room temperature (RT), by using inductively coupled plasma chemical vapour deposition (ICP-CVD) method. The presented device exhibit mobility (~ 656 cm2 V−1.s−1) and On/Off ratio (>106) at par with conventional Si devices. The fabricated flexible Si NRFETs were evaluated under multiple bending cycles (~100) and the performance was found to be stable. The presented approach demonstrates the potential for direct printing of high performance flexible electronics.\",\"PeriodicalId\":101496,\"journal\":{\"name\":\"2020 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)\",\"volume\":\"187 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-08-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/FLEPS49123.2020.9239533\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/FLEPS49123.2020.9239533","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Si Nanoribbons based High Performance Printed FETs using Room-Temperature deposited Dielectric
This paper presents the fabrication and characterization of transfer printed Si nanoribbons (NRs) based field effect transistor (NRFETs). The critical steps such as high-k gate dielectric (silicon nitride (SiN)) were carried out at room temperature (RT), by using inductively coupled plasma chemical vapour deposition (ICP-CVD) method. The presented device exhibit mobility (~ 656 cm2 V−1.s−1) and On/Off ratio (>106) at par with conventional Si devices. The fabricated flexible Si NRFETs were evaluated under multiple bending cycles (~100) and the performance was found to be stable. The presented approach demonstrates the potential for direct printing of high performance flexible electronics.