300mm晶圆和小批量对LSI制造系统最终测试过程效率和成本的影响

IEEE/SEMI 1998 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (Cat. No.98CH36168) Pub Date : 1998-09-23 DOI:10.1109/ASMC.1998.731478

K. Nakamae, A. Chikamura, H. Fujioka

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引用次数: 4

摘要

由于晶圆尺寸从传统的5或6英寸过渡到300毫米(12英寸)，因此批量尺寸变化对当前最终测试过程效率和成本的影响通过模拟分析进行了评估。结果表明，在1 ~ 25片300mm晶圆范围内，采用适当的调度规则，在最终测试过程中采用接近测试设备批量的小加工和移动批量，可以保持较高的测试效率和较低的测试成本。

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Effect of 300 mm wafer and small lot size on final test process efficiency and cost of LSI manufacturing system

The effect of lot size change on the current final test process efficiency and cost due to the transition of from conventional 5 or 6 inches to 300 mm (12 inches) in wafer size is evaluated through simulation analysis. Results show that high test efficiency and low test cost are maintained regardless of lot size in the 300 mm wafer range from one sheet to 25 sheets by using an appropriate dispatching rule and a small processing and moving lot size close to the batch size of testing equipment in the final test process.

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来源期刊

IEEE/SEMI 1998 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (Cat. No.98CH36168)

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