所选聚酰亚胺的表面自由能和6CHBT在这些表面上的锚定能

Jerzy Borycki, M. Wilczek, J. Kędzierski, M. Kojdecki
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引用次数: 2

摘要

以芳香族二酐和二胺为原料,在二甲基甲酰胺中制备了聚酰胺酸。用聚胺酸溶液对玻璃或氧化铟锡(ITO)玻璃板进行旋涂并干燥。然后进行了热亚酰化处理。采用楔形槽法测定了6CHBT分子在聚酰亚胺和聚酰胺亚胺表面的极性锚定能系数。由van Oss, Fowkes和Owens方程求出了表面自由能及其分量。结果表明,聚合物层与6CHBT和PCB液晶的润湿性与亚胺化温度有关。在250℃下制备的聚酰亚胺层的润湿性最差,而在350℃下烘烤的聚酰亚胺层的润湿性最好。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Surface free energy of chosen polyimides and anchoring energy of 6CHBT on these surfaces
Poly(amic acids) were prepared from chosen aromatic dianhydrides and diamines in dimethylformamide. The glass or the indium tin oxide (ITO)-glass plates were spin-coated with the poly(amic acids) solutions and dried. A thermal imidization process was then carried out. The polar anchoring energy coefficient of 6CHBT molecules on polyimide and poly(amide imides) surfaces was determined by wedge cell method for. The surface free energies and its components were found from van Oss, Fowkes and Owens equations. It was shown that wettability of polymer layers with the 6CHBT and PCB liquid crystals depend on the imidization temperature. The worst wettability was observed for polyimide layers prepared at 250°C, whereas the best for baked at 350°C.
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