Jerzy Borycki, M. Wilczek, J. Kędzierski, M. Kojdecki
{"title":"所选聚酰亚胺的表面自由能和6CHBT在这些表面上的锚定能","authors":"Jerzy Borycki, M. Wilczek, J. Kędzierski, M. Kojdecki","doi":"10.1117/12.581211","DOIUrl":null,"url":null,"abstract":"Poly(amic acids) were prepared from chosen aromatic dianhydrides and diamines in dimethylformamide. The glass or the indium tin oxide (ITO)-glass plates were spin-coated with the poly(amic acids) solutions and dried. A thermal imidization process was then carried out. The polar anchoring energy coefficient of 6CHBT molecules on polyimide and poly(amide imides) surfaces was determined by wedge cell method for. The surface free energies and its components were found from van Oss, Fowkes and Owens equations. It was shown that wettability of polymer layers with the 6CHBT and PCB liquid crystals depend on the imidization temperature. The worst wettability was observed for polyimide layers prepared at 250°C, whereas the best for baked at 350°C.","PeriodicalId":132866,"journal":{"name":"Liquid crystals (Print)","volume":"106 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Surface free energy of chosen polyimides and anchoring energy of 6CHBT on these surfaces\",\"authors\":\"Jerzy Borycki, M. Wilczek, J. Kędzierski, M. Kojdecki\",\"doi\":\"10.1117/12.581211\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Poly(amic acids) were prepared from chosen aromatic dianhydrides and diamines in dimethylformamide. The glass or the indium tin oxide (ITO)-glass plates were spin-coated with the poly(amic acids) solutions and dried. A thermal imidization process was then carried out. The polar anchoring energy coefficient of 6CHBT molecules on polyimide and poly(amide imides) surfaces was determined by wedge cell method for. The surface free energies and its components were found from van Oss, Fowkes and Owens equations. It was shown that wettability of polymer layers with the 6CHBT and PCB liquid crystals depend on the imidization temperature. The worst wettability was observed for polyimide layers prepared at 250°C, whereas the best for baked at 350°C.\",\"PeriodicalId\":132866,\"journal\":{\"name\":\"Liquid crystals (Print)\",\"volume\":\"106 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Liquid crystals (Print)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1117/12.581211\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Liquid crystals (Print)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1117/12.581211","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Surface free energy of chosen polyimides and anchoring energy of 6CHBT on these surfaces
Poly(amic acids) were prepared from chosen aromatic dianhydrides and diamines in dimethylformamide. The glass or the indium tin oxide (ITO)-glass plates were spin-coated with the poly(amic acids) solutions and dried. A thermal imidization process was then carried out. The polar anchoring energy coefficient of 6CHBT molecules on polyimide and poly(amide imides) surfaces was determined by wedge cell method for. The surface free energies and its components were found from van Oss, Fowkes and Owens equations. It was shown that wettability of polymer layers with the 6CHBT and PCB liquid crystals depend on the imidization temperature. The worst wettability was observed for polyimide layers prepared at 250°C, whereas the best for baked at 350°C.