创新实践环节6C:测试压缩的最新实践

J. E. Colburn, K. Chung, H. Konuk, Y. Dong
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引用次数: 0

摘要

为了在合理的测试时间和可接受的测试成本内达到所需的测试质量水平,测试压缩已成为许多设计的要求。本次会议将涵盖测试压缩解决方案的一些权衡和选项。第一次演讲将讨论在测试大量逻辑块和处理器内核时保持高测试质量而不增加测试成本的困难,因为需要为数字测试分配更多引脚。简单地为测试添加更多的芯片级引脚与封装限制相冲突,并且可能潜在地破坏依赖于使用较少引脚的其他节省成本的技术,例如多站点测试。相反,我们需要的是针对使用多核处理器的复杂SOC设计进行优化的DFT策略,该策略中架构和自动化元素协同工作以降低测试成本,而不会影响测试质量或显着增加自动测试模式生成(ATPG)运行时。本次演讲重点介绍了一种优化的DFT架构,称为DFTMAX的“共享I/O”,这是一种基于综合的测试解决方案,已成功用于多核处理器设计以及复杂的SOC设计。使用这种方法,他们能够在相同甚至更少的ATPG模式下显著减少扫描测试引脚,而不影响测试覆盖率,并将晶圆级扫描测试时间减少了2倍以上。第二次演讲将介绍许多DFT技术,以减少测试时间并提高核心包装上下文的覆盖率。其中一些方法包括在每个位置和路由块中使用具有单独压缩逻辑的外部扫描链,而不是为来自不同位置和路由的所有外部扫描链使用“芯片顶部”扫描压缩逻辑。此外,还将介绍使用动态移动发射/捕获发射(LOS/LOC)而不是静态发射的一些权衡。本文还将介绍一些其他方法,以防止在发射-移位测试模式期间减压器逻辑输入X',以及控制测试点减少ATPG矢量计数的好处。最后的介绍将涵盖各种方法,以减少不同芯片上的测试数据量。本文还将讨论未来实现更高压缩比的一些工作。与任何好的工程解决方案一样,这些选择也需要考虑一些约束和权衡。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Innovative practices session 6C: Latest practices in test compression
Test compression has become a requirement for many designs to meet the required test quality levels in reasonable test times and with acceptable test cost. This session will cover some of the tradeoffs and options available from the broad spectrum of test compression solutions. The first talk will address the difficulty when testing large numbers of logic blocks and processor cores of maintaining high test quality without a requisite increase in test cost stemming from the need to allocate substantially more pins for digital test. Simply adding more chip-level pins for testing conflicts with packaging constraints and can potentially undermine other cost-saving techniques that rely on utilizing fewer pins such as multi-site testing. What is needed instead is a DFT strategy optimized for complex SOC designs that use multicore processors-a strategy in which the architecture and automation elements work in tandem to lower test cost without compromising test quality or significantly increasing automatic test pattern generation (ATPG) runtime. This presentation highlights an optimized DFT architecture, referred to as “shared I/O” of DFTMAX, a synthesis-based test solution that has been used successfully in multicore processor designs as well as complex SOC designs. Using this approach, they were able to reduce scan test pins significantly with similar or even less ATPG patterns, without compromising test coverage, and achieve over 2X reduction in wafer level scan test time. The second talk will present many DFT techniques to reduce test time and improve coverage in the context of core wrapping. Some of these methods include using external scan chains with separate compression logic inside each place-and-route block instead of having ‘chip-top’ scan compression logic for all external scan chains from different place-and-route. In addition, some tradeoffs of using dynamic launch-on-shift/launch-on-capture (LOS/LOC) instead of static will be covered. Some other methods will be covered for preventing decompressor logic from feeding X'es during launch-on-shift test patterns and the benefits of control test-points to reduce ATPG vector counts. The final presentation will cover various methodologies for reducing the test data volume on different chips. Some work to achieve a higher compression ratio in the future will also be discussed. As with any good engineering solution, there are some constraints and tradeoffs that also need to be considered with those choices.
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