互连寄生电容的基于连通性的机器学习紧凑模型

Mohamed Saleh Abouelyazid, S. Hammouda, Y. Ismail
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引用次数: 3

摘要

提出了一种基于规则的互连寄生电容的神经网络寄生提取建模方法。目前基于规则的提取器依赖于成千上万的寄生电容公式,每个公式只覆盖很少或非常有限的互连模式集。在极端情况下,这些公式通常也会出现很大的错误。所提出的方法提供了紧凑的横截面神经网络模型,该模型可以预测考虑金属连通性的许多不同金属排列的寄生耦合电容。这些模型显著提高了基于规则的提取方法的准确性。此外,它们还显著减少了传统基于规则的方法中的模式不匹配。所提出的紧凑模型的输入是:布局模式的尺寸、攻击者多边形和特定过程堆栈所需的受害者多边形。提出了两种不同的模式表示作为神经网络模型的输入:基于比例的表示和基于维度的表示。与传统的现有模型相比,所提出的方法在四个方面显示出优越的特点。第一,模式覆盖率高。其次,它减轻了模式不匹配。第三,它提供了紧凑的、描述性的和准确的横截面寄生模型。第四,能够处理高级节点日益提高的精度要求。在三个28nm制程节点的测试芯片上进行了测试,互连结构超过4.8M。与现场求解器相比,所提出的方法显著减少了模式不匹配,并提供了出色的结果,平均误差< 0.1%,标准偏差< 3.2%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Connectivity-Based Machine Learning Compact Models for Interconnect Parasitic Capacitances
A novel neural-networks parasitic extraction modeling methodology for interconnect parasitic capacitances is developed in rule-based extractors. The current rule-based extractors rely on thousands of parasitic capacitance formulas, each covering few or very limited set of interconnect patterns. These formulas also typically suffer from large errors in corner cases. The proposed methodology provides compact cross-section neural-network models that predict parasitic coupling capacitances for many diverse metal arrangements considering metals connectivity. These models significantly improve the accuracy of rule-based extraction methods. Also, they significantly reduce the pattern mismatches in traditional rule-based methods. The inputs to the proposed compact models are: dimensions of a layout pattern, aggressor polygons, and the required victim polygons for a certain process stack. Two different pattern representations are proposed to be used as inputs to neural-networks models: ratio-based and dimensions-based representations. The proposed methodology shows superior characteristics as compared to traditional existing models in four ways. First, it has high pattern coverage. Second, it mitigates the pattern mismatches. Third, it provides compact, descriptive, and accurate cross-section parasitic models. Fourth, it can handle the increasing accuracy requirements in advanced nodes. The proposed methodology is tested over three test chips of 28nm process node with more than 4.8M interconnect structures. The proposed methodology managed to significantly reduce the pattern mismatches and provided outstanding results as compared to field-solvers with an average error < 0.1% and a standard deviation < 3.2%.
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