电源芯片正面和背面同时镀铜

2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO) Pub Date : 2017-05-01 DOI:10.23919/MIPRO.2017.7966574

C. Melvin, B. Roelfs

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引用次数: 2

摘要

介绍了一种在电源芯片上电镀铜的新工具和新工艺。该工具通过在晶圆的两侧同时电镀，实现了一种新的，更有效的嵌入功率芯片的方法。本文将讨论的其他工具特性为嵌入式技术提供了技术优势，并使电源芯片封装进一步小型化，以满足未来的需求和产品。

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Simultaneous front and back side Cu metallization on power chips

This article describes a new tool and process for Cu electroplating on power chips. The tool enables a new, more efficient method for embedding power chips by means of simultaneous electroplating on both sides of the wafer. Additional tool features, to be discussed in this article, provide technical benefits for embedded technologies and enable further miniaturization of power chip packages to comply with future requirements and products.

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来源期刊

2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO)

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