XPS检测Cu- 30cr -0.01 te合金接触材料Cu/Cr相界面微量te偏析

2011 1st International Conference on Electric Power Equipment - Switching Technology Pub Date : 2011-10-01 DOI:10.1109/ICEPE-ST.2011.6122972

Jinglin Xie, B. Miao

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引用次数: 3

摘要

采用x射线光电子能谱研究了Cu-30Cr-0.01Te合金接触材料中Te偏析的组成和键能。Cu- 30cr -0.01Te合金接触材料新鲜断口表面主要化学元素Cu、Cr和Te的光电子图表明，Te原子在Cu/Cr相界面处高度偏析，从而改变了Cu/Cr相界面的结构和性能，导致接触材料的抗拉强度降低，抗焊接性能提高。

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Detection of micro-Te segregation at the interface of Cu/Cr phases in Cu-30Cr-0.01Te alloy contact material by XPS

The composition and bonding energy of Te segregation in Cu-30Cr-0.01Te alloy contact material were investigated by X-ray photoelectron spectroscopy. Photoelectron patterns from the main chemical elements of Cu, Cr and Te on the fresh fracture surface of Cu-30Cr-0.01Te alloy contact material show that Te atoms highly segregated at the interface of Cu/Cr phases, thus the structure and property of the interface between Cu/Cr phases were changed and led to reduce the tensile strength and increase anti-welding property of the contact material.

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2011 1st International Conference on Electric Power Equipment - Switching Technology

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