用于FinFET和CNTFET技术的低功耗SRAM单元设计

J. Delgado-Frías, Zhe Zhang, M. A. Turi
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引用次数: 28

摘要

本文介绍了SRAM单元在FinFET和碳纳米管FET (CNTFET)技术中的实现。国际半导体技术路线图已将这些技术确定为可能取代大块CMOS的候选技术。泄漏电流是SRAM阵列功耗的主要来源之一;finfet已被证明可以大大降低泄漏电流。介绍了FinFET存储单元。这些电池的静电功耗为0.49µW。CNTFET存储器的静态功率为0.195µW。在目前的合成工艺中,金属碳纳米管与半导体碳纳米管一起生长,采用金属容限方案来克服金属碳纳米管的存在。这种具有金属公差的CNTFET存储器的静电功耗为0.21µW。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Low power SRAM cell design for FinFET and CNTFET technologies
Implementations of SRAM cells in FinFET and carbon nanotube FET (CNTFET) technologies are presented in this paper. The International Technology Roadmap for Semiconductors has identified these technologies as likely candidates to replace bulk CMOS. Leakage current is one of the major contributors in the power consumption in SRAM arrays; FinFETs have been shown to greatly reduce leakage current. The FinFET memory cells are presented. These cells dissipate 0.49 µW of static power. The CNTFET memory requires 0.195 µW of static power. In current synthesis processes Metallic CNTs are grown along with semiconductor CNTs, a metallic tolerant scheme is used to overcome the presence of metallic CNT. This CNTFET memory with metallic tolerance dissipates 0.21 µW of static power.
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