脉冲激光沉积微谐振器封装后调谐

TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664) Pub Date : 2003-06-08 DOI:10.1109/SENSOR.2003.1217141

M. Chiao, L. Lin

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引用次数: 5

摘要

提出了一种基于脉冲激光沉积的微谐振器封装后调谐工艺。微谐振器首先使用RTP(快速热处理)铝-氮化硅键合工艺进行密封封装。然后通过使用PLD在结构表面添加材料来改变谐振器质量，以达到所需的谐振频率。实验结果表明，激光光斑尺寸为25/spl次/25 /spl μ /m/sup 2/，能量为587 mJ/cm/sup 2/，脉冲持续时间为6纳秒，以厚度为0.35 /spl μ /m的金薄膜作为沉积材料，梳状驱动微谐振器谐振频率为12.45 KHz，调谐分辨率为0.5%。

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Post-packaging tuning of microresonators by pulsed laser deposition

This paper presents a post-packaging tuning process for microresonators by PLD (Pulsed Laser Deposition). The microresonators are first hermetically packaged using the RTP (Rapid Thermal Processing) aluminum-to-silicon nitride bonding process. The resonator mass is then altered by adding materials on the surface of the structure using PLD to achieve the desired resonant frequency. The demonstrated tuning resolution is 0.5 % per laser shot with the laser beam spot size of 25/spl times/25 /spl mu/m/sup 2/, energy of 587 mJ/cm/sup 2/, pulse duration of 6 nano second, and 0.35 /spl mu/m-thick gold film as the deposition material for comb-drive microresonators resonating at 12.45 KHz.

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TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664)

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