{"title":"一种高贵的VFO(垂直线扇出)技术，适用于小尺寸和高性能内存应用","authors":"Ki-Jun Sung, Kyoungtae Eun, Seowon Lee, Sungwon Yoon, H.-Y Son, Kang-wook Lee","doi":"10.1109/EDTM55494.2023.10102966","DOIUrl":null,"url":null,"abstract":"FOWLP technology is one of the latest technologies to meet the requirements of small form-factor and high performance for mobile application. In this paper, a new VFO package has been introduced as the next generation platform based on FOWLP technology. This package has unique features of vertical wires on reconstructing stacked dies and multiple RDLs. VFO technology shows a thinner z-height with a stable package warpage, good thermal performance and an enhanced electrical characterization as well as a good reliability. Therefore, it will lead a small form factor and high performance memory application.","PeriodicalId":418413,"journal":{"name":"2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)","volume":"127 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A noble VFO(Vertical wire Fan Out) technology for small form factor and high performance memory applications\",\"authors\":\"Ki-Jun Sung, Kyoungtae Eun, Seowon Lee, Sungwon Yoon, H.-Y Son, Kang-wook Lee\",\"doi\":\"10.1109/EDTM55494.2023.10102966\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"FOWLP technology is one of the latest technologies to meet the requirements of small form-factor and high performance for mobile application. In this paper, a new VFO package has been introduced as the next generation platform based on FOWLP technology. This package has unique features of vertical wires on reconstructing stacked dies and multiple RDLs. VFO technology shows a thinner z-height with a stable package warpage, good thermal performance and an enhanced electrical characterization as well as a good reliability. Therefore, it will lead a small form factor and high performance memory application.\",\"PeriodicalId\":418413,\"journal\":{\"name\":\"2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)\",\"volume\":\"127 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-03-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDTM55494.2023.10102966\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDTM55494.2023.10102966","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A noble VFO(Vertical wire Fan Out) technology for small form factor and high performance memory applications
FOWLP technology is one of the latest technologies to meet the requirements of small form-factor and high performance for mobile application. In this paper, a new VFO package has been introduced as the next generation platform based on FOWLP technology. This package has unique features of vertical wires on reconstructing stacked dies and multiple RDLs. VFO technology shows a thinner z-height with a stable package warpage, good thermal performance and an enhanced electrical characterization as well as a good reliability. Therefore, it will lead a small form factor and high performance memory application.
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